Bluetooth headset case
Latest Shenzhen Earfun Technology Co., Ltd. Patents:
The broken lines shown in the drawings are included for the purpose of illustrating portions of the Bluetooth headset case that form no part of the claimed design.
Claims
The ornamental design for a Bluetooth headset case, as shown and described.
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Type: Grant
Filed: Feb 22, 2022
Date of Patent: Apr 2, 2024
Assignee: Shenzhen Earfun Technology Co., Ltd. (Shenzhen)
Inventor: Hui-Cun Liu (Shenzhen)
Primary Examiner: Nathaniel D. Buckner
Application Number: 29/827,838