Headphone

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Description

FIG. 1 is a front, right and top perspective view of a headphone, showing my design.

FIG. 2 is a rear, left and bottom perspective view thereof.

FIG. 3 is a front elevation view thereof.

FIG. 4 is a rear elevation view thereof.

FIG. 5 is a left side elevation view thereof.

FIG. 6 is a right side elevation view thereof.

FIG. 7 is a top plan view thereof.

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is a partial enlarged view of an area labeled 9 in FIG. 2.

The broken lines shown in the drawings are included for the purpose of illustrating portions of the headphone that form no part of the claimed design. In addition, the dot-dash broken lines in FIGS. 2 and 9 depict the boundaries of the enlargements that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D1028931
Type: Grant
Filed: May 25, 2022
Date of Patent: May 28, 2024
Assignee: Shenzhen Diyin Electronics Co., Ltd. (Guangdong)
Inventor: Guangyue Wang (Shandong)
Primary Examiner: Paula Allen Greene
Application Number: 29/839,961