Micro-module data center

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Description

FIG. 1 is a front, left-side, and top perspective view of a micro-module data center showing our new design;

FIG. 2 is a rear, right-side, and bottom perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof;

FIG. 9 is an enlarged view of the circled portion 9 of FIG. 1;

FIG. 10 is an enlarged view of the circled portion 10 of FIG. 1;

FIG. 11 is an enlarged view of the circled portion 11 of FIG. 1; and,

FIG. 12 is an enlarged view of the circled portion 12 of FIG. 2.

The broken lines depict portions of the micro-module data center in which the design is embodied that form no part of the claimed design.

The dot-dash lines depict the boundaries of the enlarged views and also form no part of the claimed design.

Claims

We claim the ornamental design for a micro-module data center, as shown and described.

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Patent History
Patent number: D1035043
Type: Grant
Filed: Oct 12, 2021
Date of Patent: Jul 9, 2024
Assignee: SHENZHEN ENVICOOL TECHNOLOGY CO., LTD. (Shenzhen)
Inventors: Bingjia Yi (Shenzhen), Wenchao Yin (Shenzhen), Yang Zhang (Shenzhen)
Primary Examiner: T Chase Nelson
Assistant Examiner: Sydney Margaret Parsley
Application Number: 29/811,105