Sensor housing

- LG Electronics
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Description

FIG. 1 is a perspective view of a first embodiment of a sensor housing;

FIG. 2 is a perspective view thereof;

FIG. 3 is a perspective view thereof;

FIG. 4 is a side view thereof;

FIG. 5 is a side view thereof;

FIG. 6 is a front view thereof;

FIG. 7 is a rear view thereof;

FIG. 8 is a top view thereof;

FIG. 9 is a bottom view thereof;

FIG. 10 is a perspective view of a first embodiment of a sensor housing;

FIG. 11 is a perspective view thereof;

FIG. 12 is a perspective view thereof;

FIG. 13 is a side view thereof;

FIG. 14 is a side view thereof;

FIG. 15 is a front view thereof;

FIG. 16 is a rear view thereof;

FIG. 17 is a top view thereof; and,

FIG. 18 is a bottom view thereof.

The broken lines are for purposes of illustration only and do not form a part of the claimed design.

Claims

The ornamental design for a sensor housing, as shown and described.

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Patent History
Patent number: D1038790
Type: Grant
Filed: Jun 20, 2023
Date of Patent: Aug 13, 2024
Assignee: LG INNOTEK CO., LTD. (Seoul)
Inventors: Paul Karayacoubian (Mountain Vew, CA), Rituja Dhananjay Marathe (San Francisco, CA), Bilge Kocer (Mountain View, CA), Bayard G. Gardineer, IV (Princeton, NJ)
Primary Examiner: Antoine Duval Davis
Application Number: 29/895,309