Syringe for liquid dispensing machine
Description
This article is a syringe for connecting to a liquid dispensing machine. It is also used for transporting and storing liquid materials such as solder paste, UV resin, silver paste, epoxy resin liquid, etc.
Claims
The ornamental design for a syringe for liquid dispensing machine, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| D460181 | July 9, 2002 | Swenson |
| D600498 | September 22, 2009 | Ma |
| D611310 | March 9, 2010 | Eide |
| D623291 | September 7, 2010 | Strong |
| D663023 | July 3, 2012 | Strong |
| D667950 | September 25, 2012 | Hyun |
| D798444 | September 26, 2017 | Darras |
| D836772 | December 25, 2018 | Nandi |
| D881005 | April 14, 2020 | Ikushima |
| D923432 | June 29, 2021 | Snopok |
| D926971 | August 3, 2021 | Coats |
| D942819 | February 8, 2022 | Yang |
| D943363 | February 15, 2022 | Yang |
| D946361 | March 22, 2022 | Yang |
| D957897 | July 19, 2022 | Javed |
| D1021083 | April 2, 2024 | Ikushima |
| 20190381259 | December 19, 2019 | Doubet |
| 30-0695052 | May 2013 | KR |
- Office Action issued by the Japan Patent Office on Oct. 1, 2021 for patent application No. JPD2021-010674.
Patent History
Patent number: D1039326
Type: Grant
Filed: Nov 19, 2021
Date of Patent: Aug 20, 2024
Assignee: MUSASHI ENGINEERING, INC. (Tokyo)
Inventor: Kazumasa Ikushima (Tokyo)
Primary Examiner: Joseph Kukella
Assistant Examiner: Darryl J Dardenne
Application Number: 29/790,329
Type: Grant
Filed: Nov 19, 2021
Date of Patent: Aug 20, 2024
Assignee: MUSASHI ENGINEERING, INC. (Tokyo)
Inventor: Kazumasa Ikushima (Tokyo)
Primary Examiner: Joseph Kukella
Assistant Examiner: Darryl J Dardenne
Application Number: 29/790,329
Classifications
Current U.S. Class:
D7/397