Package

- SPIGEN KOREA CO., LTD.
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Description

The file of this patent contains at least one drawing/photograph executed in color. Copies of this patent with color drawing(s)/photograph(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front perspective view of a package, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines in the drawings show portions of the package that form no part of the claimed design.

Claims

We claim the ornamental design for a package, as shown and described.

Referenced Cited
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D1007294 December 12, 2023 Yang
Patent History
Patent number: D1039966
Type: Grant
Filed: Feb 26, 2024
Date of Patent: Aug 27, 2024
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventors: Hyunjun Yang (Seoul), Yunhwan Kim (Seoul), Deokhun Moon (Seoul), Goeun Lee (Seoul)
Primary Examiner: Rhea Shields
Application Number: 29/929,886
Classifications
Current U.S. Class: D9/415