Case for electronic communications device
Latest SPIGEN KOREA CO., LTD. Patents:
Description
The broken lines throughout the drawing figures depict portions of the case for electronic communications device that form no part of the claimed design. The broken lines and regions bounded by broken lines form no part of the claimed design.
Claims
The ornamental design for a case for electronic communications device, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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- Spigem Slim Armor Slot for Samsung Galaxy Z Fold Case, [online] URL: https://www.spigen.com/products/galaxy-z-fold-4-series-slim-armor-slot (Year: 2024).
- Spigen Neo Hybrid S Designed for Galaxy Z Fold 4 Case, publication date Aug. 10, 2022, [online] URL: https://www.amazon.com/Spigen-Hybrid-Designed-Galaxy-Fold/dp/B09ZMQCHGN/ (Year: 2022).
Patent History
Patent number: D1040146
Type: Grant
Filed: Sep 19, 2022
Date of Patent: Aug 27, 2024
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventor: Tae Sung Yoon (Seoul)
Primary Examiner: L. A. Grabenstetter
Application Number: 29/866,557
Type: Grant
Filed: Sep 19, 2022
Date of Patent: Aug 27, 2024
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventor: Tae Sung Yoon (Seoul)
Primary Examiner: L. A. Grabenstetter
Application Number: 29/866,557
Classifications
Current U.S. Class:
D3/218;
D3/249