Electrical connector

- SAMTEC, INC.
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Description

FIG. 1 is a top, front, and left side perspective view of an electrical connector showing our new design;

FIG. 2 is a top, back, and right side perspective view thereof;

FIG. 3 is a top, front, and left side perspective view thereof;

FIG. 4 is bottom, back, and right side perspective view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a front view thereof;

FIG. 8 is a back view thereof;

FIG. 9 is a left side view thereof; and,

FIG. 10 is a right side view thereof.

The broken lines in the drawing views are included to show portions of the electrical connector that form no part of the claimed design.

Claims

The ornamental design for an electrical connector, as shown and described.

Referenced Cited
U.S. Patent Documents
D575743 August 26, 2008 Shifris
D660246 May 22, 2012 Bodmann
D766832 September 20, 2016 Harper, Jr.
D877084 March 3, 2020 Buck
D877700 March 10, 2020 Buck
D913950 March 23, 2021 Chen
D913951 March 23, 2021 Chen
D924169 July 6, 2021 Buck
D941252 January 18, 2022 Musser
D941779 January 25, 2022 Buck
D950498 May 3, 2022 Musser
D950499 May 3, 2022 Musser
D958090 July 19, 2022 Buck
D965530 October 4, 2022 Faith
D987576 May 30, 2023 Omodachi
D996368 August 22, 2023 Yamazaki
Other references
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/610,936, filed Jul. 17, 2017.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/611,028, filed Jul. 18, 2017.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/721,751, filed Jan. 23, 2020.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/768,738, filed Feb. 1, 2021.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/819,291, filed Dec. 14, 2021.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/611,655, filed Jul. 24, 2017.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/725,670, filed Feb. 26, 2020.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/647,260, filed May 11, 2018.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/652,017, filed Dec. 20, 2018.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/725,389, filed Feb. 25, 2020.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/819,343, filed Dec. 14, 2021.
Patent History
Patent number: D1041426
Type: Grant
Filed: Jun 3, 2022
Date of Patent: Sep 10, 2024
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Christy Nemeth
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/841,152
Classifications
Current U.S. Class: Connector, Conductor Or Housing Therefor (10) (D13/133)