Abstract: An electrical connector includes a housing and an aligner. The aligner is defined by a connector base of the housing or by an alignment peg. The aligner defined by the connector base is configured to cooperate with a corresponding fiducial to properly align the electrical connector on a mounting surface of a substrate. The aligner defined by an alignment peg includes a main body and an embossed portion that defines a protrusion that extends from the main body. The embossed portion is configured to mate with a raised or recessed portion of a substrate to properly locate and align the electrical connector to the substrate.

Abstract: A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

Abstract: Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.

Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.

Abstract: Electrical cables are disclosed can include at least one electrical conductor, an inner electrical insulator that surrounds the at least one electrical conductor, and an electrical shield disposed about the inner electrical insulator. The electrical cables can include an electrically conductive material disposed between adjacent layers of the electrical cable. In one example, an electrical coating can be disposed in the electrical shield, for instance, in regions of overlap. Flowable electrically conductive materials are also disclosed that can flow into gaps during operation of the electrical cable.

Abstract: Flex circuit embodiments are provided having high signal conductor density and high signal integrity. Electrical communication systems are described that are configured to be placed in electrical communication with the flex circuits. Electrical communication systems are described that include an electrical connector that is selectively intermatable with an electrical connector that is mounted to a flex circuit, and an electrical connector that is mounted to a substrate such as a printed circuit board (PCB).

Abstract: A twinaxial cable splitter is in electrical communication with an IC die package. First and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package. Thus, a method is provided for testing an IC die package assembly by placing an IC package testing device in electrical communication with a first electrical connector mounted to a package substrate of the die package assembly that includes the package substate and an IC die mounted on the package substrate, and determining at least one performance metric of the die package assembly.

Abstract: A cable connector includes a cable including a center conductor, a first housing, and an overmold attached to the cable and the first housing. The cable connector can include a second housing and the overmold can be attached to the second housing. Alternatively, a cable connector system includes a cable connector including a first latch, and a board connector including a second latch and a shield, wherein the shield is staked to a substrate, and a body of the cable connector includes an outer wall that extends over the shield when the cable connector is mated to the board connector.

Abstract: An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.