Patents Assigned to Samtec, Inc.
  • Patent number: 11923640
    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: March 5, 2024
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck
  • Publication number: 20240061193
    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 22, 2024
    Applicant: Samtec, Inc.
    Inventors: Eric J. ZBINDEN, Thomas A. HALL, III
  • Patent number: 11883057
    Abstract: A surgical instrument for use during a surgical procedure includes an instrument body, an ultrasonic transducer assembly extending along a longitudinal axis, a power cord, and a transducer slip joint. The ultrasonic transducer assembly is rotatably mounted within the instrument body about the longitudinal axis and defines a first outer profile. The power cord projects from the instrument body to provide electrical power to the ultrasonic transducer assembly for operating an acoustic waveguide. The transducer slip joint is positioned between the power cord and the ultrasonic transducer assembly and electrically and mechanically connects the power cord to the ultrasonic transducer assembly. The ultrasonic transducer assembly selectively rotates relative to the power cord for inhibiting the power cord from winding upon rotation of the ultrasonic transducer assembly. The transducer slip joint also defines a second outer profile that fits within the first outer profile of the ultrasonic transducer assembly.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: January 30, 2024
    Assignees: Cilag GmbH International, SAMTEC Inc.
    Inventors: Eric Roberson, James E. Borgelt, Douglas E. McCartin
  • Patent number: 11846816
    Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: December 19, 2023
    Assignee: SAMTEC, INC.
    Inventor: Eric Zbinden
  • Patent number: 11828908
    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: November 28, 2023
    Assignee: SAMTEC, INC.
    Inventors: Eric J. Zbinden, Thomas A. Hall, III
  • Patent number: 11824294
    Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: November 21, 2023
    Assignee: SAMTEC, INC.
    Inventor: Jonathan E. Buck
  • Publication number: 20230335960
    Abstract: A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.
    Type: Application
    Filed: February 4, 2021
    Publication date: October 19, 2023
    Applicant: SAMTEC, INC.
    Inventors: Brandon Thomas GORE, Richard MELLITZ, Gauss YANG, Kelly GARRISON, Norman S. MCMORROW
  • Patent number: 11769969
    Abstract: A connector includes a housing; a cage surrounding the housing; first contacts that are located in the housing and that transmit high-speed signals; second contacts that are located in the housing, that transmit low-speed signals, and that each include a portion that extends from a top surface of the housing; first cables connected to the first contacts; and second cables connected to the second contacts.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: September 26, 2023
    Assignee: SAMTEC, INC.
    Inventors: Jignesh H. Shah, Jean Karlo Williams Barnet
  • Patent number: 11735844
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Publication number: 20230251441
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: April 14, 2023
    Publication date: August 10, 2023
    Applicant: Samtec, Inc.
    Inventors: Eric J. ZBINDEN, Randall E. MUSSER, Jean-Marc A. VERDIELL, John A. MONGOLD, Brian R. VICICH, Keith R. GUETIG
  • Patent number: 11693194
    Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: July 4, 2023
    Assignee: SAMTEC, INC.
    Inventors: Jignesh H. Shah, William J. Kozlovsky, David A. Langsam, Raymond J. Lee, R. Brad Bettman, Eric Jean Zbinden
  • Patent number: 11652325
    Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: May 16, 2023
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 11650383
    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: May 16, 2023
    Assignee: SAMTEC, INC.
    Inventors: Eric J. Zbinden, Thomas A. Hall, III
  • Patent number: 11646246
    Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: May 9, 2023
    Assignee: SAMTEC, INC.
    Inventors: Tim Mobley, Roupen Leon Keusseyan
  • Patent number: 11637404
    Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: April 25, 2023
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 11637400
    Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to be mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: April 25, 2023
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John Mongold
  • Patent number: 11626689
    Abstract: A first electrical connector includes a first latch that is configured to releasably engage a second latch of a second electrical connector when the first and second electrical connectors are mated to each other. The first latch can include an attachment portion that attaches to the connector housing of the first electrical connector, and an engagement portion that is movable with respect to the attachment portion between an engaged position and a disengaged position.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: April 11, 2023
    Assignee: SAMTEC, INC.
    Inventor: Chadrick Paul Faith
  • Patent number: D1002550
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: October 24, 2023
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D1005964
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMTEC, INC.
    Inventors: Chadrick Paul Faith, Dale Schmelz
  • Patent number: D1024967
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: April 30, 2024
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck