Heat dissipation module
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The even-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The dot-dash broken lines illustrate the boundaries of the enlarged portions and form no part of the claimed design.
Claims
The ornamental design for a heat dissipation module, as shown and described.
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Type: Grant
Filed: Sep 12, 2023
Date of Patent: Sep 17, 2024
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Yu Lai (New Taipei), Yi-Heng Lee (New Taipei)
Primary Examiner: Leanne Was-Englehart
Application Number: 29/902,301