Heat dissipation module

- Acer Incorporated
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Description

FIG. 1 is a perspective view of a heat dissipation module showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof;

FIG. 9 is an enlarged view of the portion, labeled ‘9’ in FIG. 1; and,

FIG. 10 is an enlarged view of the portion, labeled ‘10’ in FIG. 3;

The even-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The dot-dash broken lines illustrate the boundaries of the enlarged portions and form no part of the claimed design.

Claims

The ornamental design for a heat dissipation module, as shown and described.

Referenced Cited
U.S. Patent Documents
D396276 July 21, 1998 Horng
D398392 September 15, 1998 Horng
D398977 September 29, 1998 Horng
D398978 September 29, 1998 Horng
D399946 October 20, 1998 Horng
D400665 November 3, 1998 Horng
D401686 November 24, 1998 Horng
5873406 February 23, 1999 Horng
D408514 April 20, 1999 Horng
5940269 August 17, 1999 Ko
D418216 December 28, 1999 Horng
6135200 October 24, 2000 Okochi
6137680 October 24, 2000 Kodaira
6252770 June 26, 2001 Yu
D570794 June 10, 2008 Horng
D570795 June 10, 2008 Horng
D571313 June 17, 2008 Horng
D571314 June 17, 2008 Horng
D928161 August 17, 2021 Fan
D979571 February 28, 2023 Feng
D997109 August 29, 2023 Tso
20180196483 July 12, 2018 Han
20180203493 July 19, 2018 Han
20180213680 July 26, 2018 Han
20210116979 April 22, 2021 Walker
20230171914 June 1, 2023 Lin
20230205285 June 29, 2023 Walker
Other references
  • [Up Your Game], posted Nov. 26, 2020 [online], [retrieved Nov. 13, 2023]. Retrieved from internet, <https://global.aorus.com/blog-detail.php?i=865> (Year: 2020).
Patent History
Patent number: D1042778
Type: Grant
Filed: Sep 12, 2023
Date of Patent: Sep 17, 2024
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Yu Lai (New Taipei), Yi-Heng Lee (New Taipei)
Primary Examiner: Leanne Was-Englehart
Application Number: 29/902,301
Classifications
Current U.S. Class: Heat Sink (D13/179)