Heat Sink Patents (Class D13/179)
  • Patent number: 12092406
    Abstract: A two-phase immersion-type heat dissipation structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate and a plurality of non-vertical fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the non-vertical fins, a cross-sectional contour of one of the non-vertical fins has a top end point and a bottom end point connected with the fin surface, and the top and bottom end points are opposite to each other. A length of a cross-sectional contour line defined from the top end point to the bottom end point is greater than a perpendicular line length of a perpendicular line defined from the top end point to the fin surface.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: September 17, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Ching-Ming Yang, Chun-Te Wu, Tze-Yang Yeh
  • Patent number: D953280
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 31, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD
    Inventors: Shuta Hikichi, Yoshikatsu Inagaki, Yosuke Watanabe
  • Patent number: D954005
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: June 7, 2022
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu Inagaki, Shuta Hikichi
  • Patent number: D952585
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: May 24, 2022
    Assignee: DYNATRON CORPORATION
    Inventor: Tai-Chi Huang
  • Patent number: D954661
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: June 14, 2022
    Inventors: Robert A. Sonneman, Christian N. Garnett, Yangyang Wang, Nuno Pires Da Silva
  • Patent number: D954662
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: June 14, 2022
    Inventors: Robert A. Sonneman, Christian N. Garnett, Yangyang Wang, Nuno Pires Da Silva
  • Patent number: D954663
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: June 14, 2022
    Inventors: Robert A. Sonneman, Christian N. Garnett, Yangyang Wang, Nuno Pires Da Silva
  • Patent number: D954664
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: June 14, 2022
    Inventors: Robert A. Sonneman, Christian N. Garnett, Yangyang Wang, Nuno Pires Da Silva
  • Patent number: D956004
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: June 28, 2022
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Jen-Hao Lin, Tian-Li Ye, Chien-Yu Chen, Chien-An Chen
  • Patent number: D956705
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: July 5, 2022
    Assignee: Lam Research Corporation
    Inventors: Bin Luo, Damien Slevin, Allan Matthew Jones
  • Patent number: D956706
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: July 5, 2022
    Assignee: ESSENCORE Limited
    Inventor: Young Suk Chung
  • Patent number: D960148
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: August 9, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jan Andersson, Nina Wendt
  • Patent number: D961535
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: August 23, 2022
    Assignee: SHOWA DENKO K.K.
    Inventor: Kazuo Igarashi
  • Patent number: D962879
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: September 6, 2022
    Assignee: Acer Incorporated
    Inventors: Shu-Hao Kuo, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: D962880
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: September 6, 2022
    Assignee: ESSENCORE Limited
    Inventor: Young Suk Chung
  • Patent number: D964947
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: September 27, 2022
    Assignee: KINGSTON DIGITAL, INC.
    Inventors: Yi-Ting Lin, Wei-Hsin Cho
  • Patent number: D965541
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: October 4, 2022
    Inventor: Yizhou Wang
  • Patent number: D965760
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: October 4, 2022
    Assignee: DYNAEON INDUSTRIAL CO., LTD.
    Inventor: Tai-Chi Huang
  • Patent number: D969760
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: November 15, 2022
    Assignee: Advanced Thermal Solutions, Inc.
    Inventors: Anatoly Pikovsky, Gregory Wong
  • Patent number: D971862
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: December 6, 2022
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu Inagaki, Shuta Hikichi, Hiroshi Sakai
  • Patent number: D976851
    Type: Grant
    Filed: May 31, 2021
    Date of Patent: January 31, 2023
    Inventors: Yi Siang She, Georg Todtenbier
  • Patent number: D977488
    Type: Grant
    Filed: May 29, 2021
    Date of Patent: February 7, 2023
    Inventor: Junbo Lin
  • Patent number: D985517
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: May 9, 2023
    Assignee: WOLFSPEED, INC
    Inventors: Brice McPherson, Matthew Feurtado
  • Patent number: D987167
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: May 23, 2023
    Assignee: OSRAM GmbH
    Inventors: Christian Seichter, Ralf Lindner, Hans Guenther Mayer
  • Patent number: D991893
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: July 11, 2023
    Assignee: Intel Corporation
    Inventors: Aleksander Magi, Duck Young Kong, Daniel Surratt, Michael Hyde
  • Patent number: D997109
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: August 29, 2023
    Assignee: DTG NEO SCIENTIFIC LIMITED
    Inventor: Louis Man Wai Tso
  • Patent number: D997335
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: August 29, 2023
    Inventor: Guo Shen
  • Patent number: D1009399
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: December 26, 2023
    Assignee: Transportation IP Holdings, LLC
    Inventors: Mark Murphy, Jain Raj Vettuvazhy Puthenpurayil, Rajendra Yammanuru, Theodore Brown
  • Patent number: D1009813
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: January 2, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: D1010803
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: January 9, 2024
    Inventors: Alexandre Pieri, Renato Poncini
  • Patent number: D1019580
    Type: Grant
    Filed: September 8, 2022
    Date of Patent: March 26, 2024
    Assignee: TRAXXAS, L.P.
    Inventors: Caleb Hix, Trent Collins, Otto Karl Allmendinger
  • Patent number: D1024985
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: April 30, 2024
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Tomas Muld, David Pell, Martin Ethier, Adrianus Van Gaal, Nan He
  • Patent number: D1026035
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: May 7, 2024
    Inventor: Sandor Kappel
  • Patent number: D1026838
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: D1033417
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: July 2, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Tobias Reese, Nina Wendt
  • Patent number: D1034490
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: July 9, 2024
    Inventor: Hongmin Li
  • Patent number: D1035597
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: July 16, 2024
    Assignee: KINGSTON DIGITAL, INC.
    Inventor: Hui-Hsin Lu
  • Patent number: D1035641
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: July 16, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Yu Xia Pan, Ting Li Lan, Zhan Bo Ren, Chang Sen Chen, Hai Gang Xiong
  • Patent number: D1037185
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: July 30, 2024
    Assignee: SOLLUM TECHNOLOGIES INC.
    Inventor: Benjamin Huneault
  • Patent number: D1038110
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: August 6, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Tobias Reese, Nina Wendt
  • Patent number: D1041429
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: September 10, 2024
    Assignee: Wolfspeed, Inc.
    Inventors: Brice McPherson, Matthew Feurtado
  • Patent number: D1042371
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: September 17, 2024
    Assignee: Dell Products L.P.
    Inventor: Jason T. Minehart
  • Patent number: D1042372
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: September 17, 2024
    Assignee: Poynting Antennas (PTY) Limited
    Inventors: Andries Petrus Cronje Fourie, Shane Michael Mundy
  • Patent number: D1042778
    Type: Grant
    Filed: September 12, 2023
    Date of Patent: September 17, 2024
    Assignee: Acer Incorporated
    Inventors: Wei-Yu Lai, Yi-Heng Lee
  • Patent number: D1046842
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: October 15, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Shi Kong Lin, Xue Kang Li, Ting Lai
  • Patent number: D1047941
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: October 22, 2024
    Inventor: Lihua Cai
  • Patent number: D1049064
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: October 29, 2024
    Assignee: MARVELL ASIA PTE LTD
    Inventors: Chris Togami, Radhakrishnan L. Nagarajan, Gary Sasser, Brian Taylor
  • Patent number: D1051080
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: November 12, 2024
    Assignee: G.SKILL INTERNATIONAL ENTERPRISE CO., LTD.
    Inventor: Chiung-Huang Huang
  • Patent number: D1051122
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: November 12, 2024
    Assignee: Apple Inc.
    Inventors: Bartley K. Andre, Matthew Phillip Casebolt, Houtan Farahani, Ron Alan Hopkinson, Eric Knopf, Jay Scott Nigen, Gavin John Reid, Mikael Silvanto, Richard Hing Tan, Eric Joel Weirshauser
  • Patent number: D1051864
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: November 19, 2024
    Assignee: Acer Incorporated
    Inventors: Wei-Yu Lai, Yi-Heng Lee