Earpiece

- SHENZHEN SHOKZ CO., LTD.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of the back, bottom, and right side view showing the new design;

FIG. 2 is a perspective view of the back, top, and left side view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a left side elevation view thereof;

FIG. 7 is a rear elevation view thereof; and,

FIG. 8 is a front elevation view thereof.

The short dash broken lines indicate portions of the bone conduction headphone that form no part of the claimed design.

Claims

The ornamental design for an earpiece as shown and described.

Referenced Cited
U.S. Patent Documents
D315561 March 19, 1991 Miller
D318669 July 30, 1991 Nakayama
D321879 November 26, 1991 Emmerling
D337587 July 20, 1993 Nakayama
D368716 April 9, 1996 Shudo
D371558 July 9, 1996 Yoshizawa
D421014 February 22, 2000 Smith
D426880 June 20, 2000 Leight
D460752 July 23, 2002 Gerdom
D471176 March 4, 2003 Suzuki
D502463 March 1, 2005 Bhakta
7076077 July 11, 2006 Atsumi et al.
D550202 September 4, 2007 Meier et al.
D557685 December 18, 2007 Lee
D559831 January 15, 2008 Lee
D575268 August 19, 2008 Christopher
D579442 October 28, 2008 Kim et al.
D617308 June 8, 2010 Nousiainen et al.
D641884 July 19, 2011 Laperle et al.
D645444 September 20, 2011 Quek
D653234 January 31, 2012 Lee et al.
D669881 October 30, 2012 Clements et al.
D678858 March 26, 2013 Feng et al.
8411893 April 2, 2013 Ito et al.
D706745 June 10, 2014 Nakagawa
D707199 June 17, 2014 Cepress et al.
D716759 November 4, 2014 Ha et al.
D717765 November 18, 2014 Rausch et al.
D721673 January 27, 2015 Park et al.
D722999 February 24, 2015 Ishikura
D740785 October 13, 2015 Chen et al.
D756959 May 24, 2016 Lee et al.
D766869 September 20, 2016 Lee et al.
D771587 November 15, 2016 Iwane et al.
D775610 January 3, 2017 Nakajima
D790501 June 27, 2017 Wang
D790502 June 27, 2017 Qi et al.
D791100 July 4, 2017 Chen et al.
D823279 July 17, 2018 Chen et al.
D829190 September 25, 2018 Bullen et al.
D834003 November 20, 2018 Maeda
D847779 May 7, 2019 Williamson et al.
D851060 June 11, 2019 Lu
D851623 June 18, 2019 Zhang et al.
D863265 October 15, 2019 Hu
D871375 December 31, 2019 Meyer
D875710 February 18, 2020 Bailey et al.
D885370 May 26, 2020 Hu
D895571 September 8, 2020 Li et al.
D906281 December 29, 2020 Zhang et al.
D907002 January 5, 2021 Zhang et al.
D912644 March 9, 2021 Liu
D915345 April 6, 2021 Zhang et al.
D919592 May 18, 2021 Trought et al.
D926726 August 3, 2021 Zhang et al.
D939476 December 28, 2021 Lee
D944227 February 22, 2022 Zhu
D953291 May 31, 2022 Mao et al.
D955364 June 21, 2022 Wu
D957361 July 12, 2022 Chen
D961546 August 23, 2022 Zhang
D964315 September 20, 2022 Essabar et al.
D964316 September 20, 2022 Tan
D964962 September 27, 2022 Zuo
D967807 October 25, 2022 Lyu
D968363 November 1, 2022 Ott et al.
D978106 February 14, 2023 Song
D980187 March 7, 2023 Su
D993211 July 25, 2023 Valach et al.
D995468 August 15, 2023 Zhang
D996391 August 22, 2023 Zhang
D1025006 April 30, 2024 Wu
D1029791 June 4, 2024 Zhang
D1029793 June 4, 2024 Ho
20140185837 July 3, 2014 Kunimoto et al.
20190029529 January 31, 2019 Haartsen
20190075389 March 7, 2019 Jan
20200084546 March 12, 2020 Mainini et al.
20210021939 January 21, 2021 Olah
20210067862 March 4, 2021 Li et al.
20210076123 March 11, 2021 Zhang et al.
20210092525 March 25, 2021 Zheng et al.
20220322017 October 6, 2022 Song et al.
20220337929 October 20, 2022 Wang et al.
20220360873 November 10, 2022 Zhang et al.
20220369020 November 17, 2022 Zhang et al.
20230061686 March 2, 2023 Wolfl
Foreign Patent Documents
303931552 November 2016 CN
304974346 January 2019 CN
305179005 May 2019 CN
305291228 August 2019 CN
305391412 October 2019 CN
305407788 October 2019 CN
305433499 November 2019 CN
305515934 December 2019 CN
305912501 July 2020 CN
306026438 September 2020 CN
306065293 September 2020 CN
308063739 June 2023 CN
6137256 June 2021 GB
6137257 June 2021 GB
6137258 June 2021 GB
6137259 June 2021 GB
6137260 June 2021 GB
6137261 June 2021 GB
6137263 June 2021 GB
6137264 June 2021 GB
D1630073 April 2019 JP
D1663716 July 2020 JP
D1695516 September 2021 JP
121236 October 2012 RU
Other references
  • “Good Design Award”, Web page <https://www.g-mark.org/award/describe/45020?locale=en>, Sep. 1, 2017.
  • “AfterShokz Open Ear Wireless Conduction Headphones”. Web page <https://www.amazon.com/AfterShokz-Open-Ear-Wireless-Conduction-Headphones/dp/B07RRQ59JR?th=1>, Jul. 23, 2019.
Patent History
Patent number: D1051091
Type: Grant
Filed: Jun 20, 2023
Date of Patent: Nov 12, 2024
Assignee: SHENZHEN SHOKZ CO., LTD. (Shenzhen)
Inventors: Haofeng Zhang (Shenzhen), Yongjian Li (Shenzhen), Lei Zhang (Shenzhen), Lei Tang (Shenzhen), Zeying Zheng (Shenzhen), Yunbin Chen (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/878,368
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)