Heat dissipation module
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Description
The dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design.
Claims
The ornamental design for a heat dissipation module as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D1051864
Type: Grant
Filed: Apr 14, 2022
Date of Patent: Nov 19, 2024
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Yu Lai (New Taipei), Yi-Heng Lee (New Taipei)
Primary Examiner: Leanne Was-Englehart
Application Number: 29/834,940
Type: Grant
Filed: Apr 14, 2022
Date of Patent: Nov 19, 2024
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Yu Lai (New Taipei), Yi-Heng Lee (New Taipei)
Primary Examiner: Leanne Was-Englehart
Application Number: 29/834,940
Classifications
Current U.S. Class:
Heat Sink (D13/179)