Solder bath

- HAKKO CORPORATION
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Description

FIG. 1 is a first perspective view of a solder bath showing our new design;

FIG. 2 is a second perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof;

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 3 thereof, in which the internal mechanism is omitted;

FIG. 10 is a cross-sectional view taken along line 10-10 in FIG. 3 thereof, in which the internal mechanism is omitted; and,

FIG. 11 is a cross-sectional view taken along line 11-11 in FIG. 5 thereof, in which the internal mechanism is omitted.

The broken lines depict portions of the solder bath in which the design is embodied that are not considered part of the claimed design.

Claims

The ornamental design for a solder bath as shown and described.

Referenced Cited
U.S. Patent Documents
D244711 June 14, 1977 Armbruster
D246857 January 3, 1978 Meuli
D275033 August 7, 1984 Postlewait
D288600 March 3, 1987 Vander Hout
D304235 October 24, 1989 Chambers
D477408 July 15, 2003 Bromley
D596517 July 21, 2009 Kesselman
D629822 December 28, 2010 Torre
D666645 September 4, 2012 Sugiyama
D705683 May 27, 2014 Lauer
D762254 July 26, 2016 Kita
D892348 August 4, 2020 Matsuyama
D926241 July 27, 2021 Li
D948072 April 5, 2022 Shapiro
11864812 January 9, 2024 Nguyen
Foreign Patent Documents
3438615 April 2005 CN
Other references
  • Hakkocorporation, “FX-305 Max. Temp. 530° C. of high power soldering pot | Hakko”, (posted Nov. 15, 2022), YouTube.com, URL:<https://www.youtube.com/watch?v=GVUArbh_60l> (Year: 2022).
  • Hakkousa, “Don't forget to register for this Thursday's webinar all about the FX-305 Digital Solder Pot!”, (posted May 23, 2023), Instagram.com, URL:<https://www.instagram.com/hakkousa/p/CsmW4sTrZlb/> (Year: 2023).
  • HinLiaDa, 110V Sodler Pot, (first available Jul. 6, 2023), Amazon.com, URL:<https://www.amazon.com/HinLlaDa-Soldering-Lead-Free-Controlfor-Temperature/dp/B0CB7H1B8Z> (Year: 2023).
Patent History
Patent number: D1066449
Type: Grant
Filed: Jan 6, 2023
Date of Patent: Mar 11, 2025
Assignee: HAKKO CORPORATION (Osaka)
Inventors: Kenta Nakamura (Osaka), Hiroyuki Masaki (Osaka), Tomoyo Maeshima (Osaka)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Mark T. Philipps
Application Number: 29/881,861
Classifications