Patents Assigned to Hakko Corporation
  • Patent number: 11273510
    Abstract: The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 15, 2022
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Tomoo Takahara
  • Publication number: 20210354225
    Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
    Type: Application
    Filed: May 12, 2020
    Publication date: November 18, 2021
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 10981241
    Abstract: A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: April 20, 2021
    Assignee: HAKKO CORPORATION
    Inventors: Hiroyuki Masaki, Teruhiko Yamamoto
  • Patent number: 10974335
    Abstract: A soldering and de-soldering station and systems including enhanced features for the soldering heating tools and load detection functionality.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: April 13, 2021
    Assignee: Hakko Corporation
    Inventors: Kenji Matsuzaki, Hitoshi Takeuchi, Kenta Nakamura
  • Patent number: 10864590
    Abstract: The present application discloses a soldering apparatus including a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including soldering regions. The soldering regions have a base region and at least one replication region existing at a position different from the base region. The replication region has an arrangement pattern that is the same as an arrangement pattern of a soldering position in the base region. The soldering apparatus includes an input portion for receiving input of positional relationship data, which represents a positional relationship between the base region and the at least one replication region, and for receiving base pattern data, which represents the arrangement pattern of the soldering position in the base region. The soldering apparatus includes a controller which causes the driving portion to move the soldering iron based on the base pattern data and the positional relationship data in a soldering operation.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda, Tomoo Takahara
  • Patent number: 10864589
    Abstract: A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda, Tomoo Takahara
  • Patent number: 10842061
    Abstract: A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: November 17, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda
  • Patent number: 10807239
    Abstract: A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: October 20, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda
  • Publication number: 20200223004
    Abstract: The invention is directed to a control station for a soldering system capable of operating with various types of soldering devices, including various soldering tip configurations, and a program and database of operating parameters that the control station utilizes to identify preferred or optimal power delivery settings for each type of soldering tip size, type of solder and type of work to be soldered so as to have the soldering control station generate and display a suggestion as to the power level settings and requirements for the optimum soldering conditions to users.
    Type: Application
    Filed: January 9, 2020
    Publication date: July 16, 2020
    Applicant: Hakko Corporation
    Inventors: Toshikazu Mochizuki, Hitoshi Takeuchi
  • Publication number: 20200198039
    Abstract: The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 25, 2020
    Applicant: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Patent number: 10646945
    Abstract: A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: May 12, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Yoshitomo Teraoka
  • Publication number: 20200130085
    Abstract: A smartphone, tablet or mobile computer based soldering system control method and apparatus to allow a user or supervisor of users to monitor and control the operating parameters of soldering devices or measuring device. The control method and apparatus has features for cartridge management, temperature calibration and control, user performance and wireless interactive control. The control method may interactively control soldering devices connected directly to a power supply and optionally soldering device components of a soldering system that includes a control station to provide power to the soldering device.
    Type: Application
    Filed: October 30, 2018
    Publication date: April 30, 2020
    Applicant: Hakko Corporation
    Inventors: Mitsuhiko Miyazaki, Yasumasa Igi, Nobuharu Boh
  • Patent number: D877219
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: March 3, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Mitsuhiko Miyazaki
  • Patent number: D879849
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: March 31, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Toshiyuki Kita
  • Patent number: D889290
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: July 7, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Tetsuo Yokoyama, Kaori Fujie
  • Patent number: D895386
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: September 8, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Hisao Nemoto
  • Patent number: D897172
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: September 29, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Toshiyuki Kita
  • Patent number: D902682
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: November 24, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Toshiyuki Kita
  • Patent number: D904849
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Hisao Nemoto
  • Patent number: D956499
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: July 5, 2022
    Assignee: HAKKO CORPORATION
    Inventor: Hisao Nemoto