Infrared radiation sensor

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Description

FIG. 1 is a perspective view of an infrared radiation sensor showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view thereof taken along lines 8--8 of FIG. 3.

The broken lines in the drawings illustrate portions of the infrared radiation sensor that form no part of the claimed design. The oblique line shading in the drawings represents transparent or translucent surfaces. Showing of internal construction is omitted from the cross-sectional view.

Claims

The ornamental design for an infrared radiation sensor, as shown and described.

Referenced Cited
U.S. Patent Documents
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D885946 June 2, 2020 Sono et al.
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Foreign Patent Documents
305165228 May 2019 CN
Other references
  • Office Action dated Oct. 17, 2023, issued in counterpart JP application No. 2023-005119, with English translation. (6 pages).
  • Office Action dated Nov. 2, 2023, issued in counterpart TW application No. 112303886, with English translation. (8 pages).
Patent History
Patent number: D1070612
Type: Grant
Filed: Aug 30, 2023
Date of Patent: Apr 15, 2025
Assignee: PANASONIC HOLDINGS CORPORATION (Osaka)
Inventor: Takahiro Sono (Shiga)
Primary Examiner: Joseph Kukella
Assistant Examiner: Molly Loch
Application Number: 29/901,280
Classifications