Sensor cover package

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Description

FIG. 1 is a top plan view of a first sensor cover package, showing my new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a front elevational view thereof; and,

FIG. 7 is a top plan view of a second sensor cover package, showing my new design, the right side elevational view, the back elevational view, the left side elevational view, the bottom plan view, and the front elevational view are the same as those of the first sensor cover package shown in FIGS. 2-6.

The broken lines in the drawings are used to illustrate unclaimed environmental structure and form no part of the claimed design.

Claims

The ornamental design for a sensor cover package, as shown and described.

Referenced Cited
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Patent History
Patent number: D1082578
Type: Grant
Filed: Aug 24, 2022
Date of Patent: Jul 8, 2025
Assignee: MURATA MANUFACTURING CO., LTD. (Kyoto)
Inventor: Toru Shimuta (Kyoto)
Primary Examiner: George D. Kirschbaum
Application Number: 29/866,003
Classifications