Abstract: A surface mount inductor includes a coil including a conducting wire winding portion with both ends on the outer circumference and a pair of extension portions that extend from the outer circumference, a molded body containing a metal magnetic powder and the coil embedded, and a pair of outer terminals disposed on the molded body and connected to the extension portions. The molded body has principal surfaces, end surfaces, and side surfaces. One principal surface serves as a mounting surface including a recessed portion with an elevated region and a lowered region. The coil is embedded in the molded body with the winding axis of the winding portion parallel to the recessed portion, and the pair of extension portions extend from the outer circumference toward the mounting surface to be exposed at the lowered region and connected to the pair of outer terminals in the lowered region.

Abstract: A common mode choke coil includes an element body formed by stacking a plurality of insulating layers in a height direction, first and second coils that are built into the element body, first and second outer electrodes that are provided on surfaces of the element body so as to face each other in a width direction and are electrically connected to one end and the other end of the first coil, and third and fourth outer electrodes that are provided on surfaces of the element body so as to face each other in the width direction and are electrically connected to one end and the other end of the second coil. When L1 and L2 are the inductances of the first and second coils, 100×|L1?L2|/((L1+L2)/2)?5 at 1 GHz.

Abstract: An embedded transformer module device includes an insulating substrate including a first side and a second side opposite to the first side and including a first cavity, a magnetic core in the first cavity, a primary winding wound horizontally around the magnetic core and having a spiral shape with more than one turn, and a secondary winding wound horizontally around the magnetic core, spaced away from the primary winding, and having a spiral shape with more than one turn.

Abstract: A laminated inductor component includes a multilayer body which includes a first side surface, a second side surface and a bottom surface, and in which a plurality of insulator layers is laminated in a lamination direction; a coil conductor in helical form including a plurality of coil conductor layers wound on the insulator layers, and having a coil length parallel to the lamination direction; a first outer conductor electrically connected to a first end of the coil conductor and exposed from the first side surface and the bottom surface in the multilayer body; and a second outer conductor electrically connected to a second end of the coil conductor and exposed from the second side surface and the bottom surface in the multilayer body. A width along the lamination direction of each of the first outer conductor and the second outer conductor is shorter than the coil length.

Abstract: A coil component is capable of suppressing occurrence of peeling at an interface between a coil conductor and resin in a magnetic portion due to heating during mounting. The coil component includes an element body that includes a coil conductor formed by winding a conductive wire coated with an insulating film, and a magnetic portion that contains metal magnetic particles and resin, and external electrodes that are electrically connected to exposed surfaces of extended portions of the coil conductor exposed on a surface of the element body, and are arranged on the surface of the element body. The metal magnetic particles are arranged in recesses formed in a surface of the conductive wire in the extended portions of the coil conductor.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via an insulator, holding the two interposers connected via the insulator on a holding portion, placing the capacitor main body on the two interposers on the holding portion such that the external electrode is connected to each of the two interposers, and removing the holding portion.

Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

Abstract: An inductor includes a core made from a metallic magnetic material, a wire wound around the core, a pair of outer electrodes coupled to respective end portions of the wire, a shielding member arranged so as to cover a top face and three or more side faces of the core, and an insulating member arranged between the core and the shielding member and having thermal conductivity. The thickness of the shielding member is set by applying the electric resistivity and permeability of the shielding member and the frequency of noise desired to be shielded to an expression for determining the depth of a skin of skin effect. The thickness of the insulating member is set according to the breakdown voltage of the insulating member and the voltage with which insulation is desired to be ensured under a use environment of the inductor.

Abstract: A semiconductor device has a semiconductor substrate, and multiple first bipolar transistors on the first primary surface side of the semiconductor substrate. The first bipolar transistors have a first height between an emitter layer and an emitter electrode in the direction perpendicular to the first primary surface. The semiconductor device further has at least one second bipolar transistor on the first primary surface side of the semiconductor substrate. The second bipolar transistor have a second height, greater than the first height, between an emitter layer and an emitter electrode in the direction perpendicular to the first primary surface. Also, the semiconductor has a first bump stretching over the multiple first bipolar transistors and the at least one second bipolar transistor.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.

Abstract: A lithium ion secondary battery that includes a positive electrode, a negative electrode, a separator, and a nonaqueous electrolytic solution. Among resistance values of at least three of the following resistance components: diffusion resistance of Li ions in the nonaqueous electrolytic solution; ohmic resistance of the nonaqueous electrolytic solution; ohmic resistance of a positive electrode mixture layer, ohmic resistance of a negative electrode mixture layer; reaction resistance of a surface of a positive electrode active material, reaction resistance of a surface of a negative electrode active material; and diffusion resistance of Li ions in the positive electrode mixture layer, diffusion resistance of Li ions in the negative electrode mixture layer, the resistance values at a position of a mixture layer nearest a current collector are smaller than the resistance values at a position of a mixture layer nearest a separator.

Abstract: A sticking type deep-body thermometer is provided that includes a body temperature measurement unit having a wiring substrate on which four temperature sensors and a processing circuit are mounted. The thermometer includes an upper case accommodating the body temperature measurement unit, an lower case that is in close contact with the upper case and a peripheral edge portion, and a sticking member stuck to an outer side surface of the lower case. The sticking member is formed in a sheet-like shape, has a pair of sticking surfaces with adhesiveness, and one sticking surface of the pair of sticking surfaces is stuck to the outer side surface of the lower case in a peelable manner.

Abstract: A wire-wound core includes a core portion extending in a longitudinal direction, first and second flange portions respectively disposed at first and second end portions of the core portion in the longitudinal direction, and at least one terminal electrode disposed at each of the first and second flange portions. When a face to be oriented toward a mount board and a face of the first flange portion facing an outer side are respectively called a bottom surface and an outer end surface, the outer end surface has a recessed portion that reaches the bottom surface. The terminal electrode disposed at the first flange portion includes a bottom surface electrode portion formed of a film conductor extending along the bottom surface of the first flange portion and an end surface electrode portion formed of a conductor filling the recessed portion and being in contact with the bottom surface electrode portion.

Abstract: An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.

Abstract: A radio frequency module includes: a first antenna connection terminal; a second antenna connection terminal different from the first antenna connection terminal; a first filter having a passband of a first frequency range including a first communication band allocated as a TDD communication band; a second filter having a passband of a second frequency range including a second communication band allocated as a TDD communication band; and a third filter having a passband of a third frequency range including a third communication band allocated as a TDD communication band. The third frequency range is located between the first frequency range and the second frequency range. The first and second filters are both connected to one of the first antenna connection terminal and the second antenna connection terminal. The third filter is connected to the other of the first antenna connection terminal and the second antenna connection terminal.

Abstract: A power amplifier circuit includes a lower transistor having a first terminal, a second terminal connected to ground, and a third terminal, wherein a first power supply voltage is supplied to the first terminal, and an input signal is supplied to the third terminal; a first capacitor; an upper transistor having a first terminal, a second terminal connected to the first terminal of the lower transistor via the first capacitor, and a third terminal, wherein a second power supply voltage is supplied to the first terminal, an amplified signal is outputted to an output terminal from the first terminal, and a driving voltage is supplied to the third terminal; a first inductor that connects the second terminal of the upper transistor to ground; a voltage regulator circuit; and at least one termination circuit that short-circuits an even-order harmonic or odd-order harmonic of the amplified signal to ground potential.

Abstract: A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.

Abstract: There are disclosed matrix filters having an input port and sub-filters connected between the input port and respective output ports. Each of the sub-filters includes a ladder circuit with n transversely-excited film bulk acoustic resonator (XBAR) series elements and n?1 capacitor shunt elements, where n, the order of the sub-filter, is an integer greater than 2. The sub-filters having noncontiguous passbands.

Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

Abstract: A filter device includes a filter between an input/output terminal and an input/output terminal, and an additional circuit connected in parallel with the filter. The filter includes at least two acoustic wave resonators defining a pass band of the filter. The additional circuit includes a longitudinally coupled resonator, and a capacitor connected between the longitudinally coupled resonator and the input/output terminal. A capacitance of a comb-shaped capacitance electrode of the capacitor is smaller than a capacitance of an IDT electrode of at least one acoustic wave resonator of the at least two acoustic wave resonators, and an area of the comb-shaped capacitance electrode of the capacitor is smaller than an area of the IDT electrode of the at least one acoustic wave resonator.