Abstract: A pulse-shaping network configured for use in a radio frequency (rf) power amplifier system, the pulse-shaping network comprising: a coupled magnetic element comprising a first inductive element magnetically coupled to a second inductive element, the first inductive element comprising a first winding disposed about a first portion of a core, and the second inductive element comprising a second winding disposed about a second portion of a core, wherein the first and second inductive elements are electrically coupled to provide three output terminals of the coupled magnetic element.

Abstract: A noise reduction circuit includes a surface-mount common mode choke coil mounted on a circuit board. Output terminals of the common mode choke coil are connected to an input capacitor via second circuit patterns. Two terminals of the input capacitor are connected to two input ends of a switching circuit via third circuit patterns. Path lengths of the second circuit patterns are longer than path lengths of the third circuit patterns. Of a plurality of current paths, the path lengths of the third circuit patterns are shortest in comparison with path lengths of other current paths. First circuit patterns are parallel and face each other to form a first parasitic capacitance, and the second circuit patterns are parallel and face each other to form second parasitic capacitances.

Abstract: An inductor component includes an element body and inductor wiring. Among outer surfaces of the element body, one specific surface is defined as a first main surface, one surface perpendicular to the first main surface is defined as a first end surface, and one surface perpendicular to the first main surface and the first end surface is defined as a bottom surface. The inductor wiring includes a winding portion. The winding portion includes an upper side portion, a lower side portion, and a first lateral side portion. The first lateral side portion linearly extends from an end of the lower side portion facing the first end surface to the same position as that of an end of the upper side portion facing the first end surface in a direction perpendicular to the first end surface.

Abstract: A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.

Abstract: An inductor component includes an element body and an inductor wiring. The element body has a planar first main surface. The inductor wiring extends inside the element body. The inductor wiring includes a plurality of wiring portions arrayed in a direction perpendicular to the first main surface. The element body includes a plurality of interlayer insulating layers filling spaces between the wiring portions that are adjacent to each other in a direction perpendicular to the first main surface. The interlayer insulating layers each contain an insulating base material and a plurality of filler particles dispersed within the base material. In a first interlayer insulating layer, which is one of the plurality of interlayer insulating layers, the average particle size of the filler particles is less than or equal to the standard deviation of the thickness of the first interlayer insulating layer.

Abstract: A power amplifier circuit includes a first amplifier, a second amplifier, a third amplifier, and a harmonic suppression circuit. The first amplifier operates on power supplied through a first supply line, and amplifies a first transmit signal in a first frequency band. The second amplifier operates on power supplied through a second supply line connected to the first supply line, and amplifies a second transmit signal in a second frequency band different from the first frequency band. The third amplifier shares an antenna with the second amplifier, and amplifies a receive signal in the second frequency band received from the antenna. The harmonic suppression circuit generates, based on a harmonic of the first transmit signal, a suppression signal to suppress the harmonic to be transferred to the first supply line, and outputs the suppression signal to the first supply line or the second supply line.

Abstract: A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.

Abstract: An inductor component includes an element body and inductor wiring. The element body has first and second electrodes connected to first and second ends of the inductor wiring, respectively. One outer surface of the element body is a first main surface, one surface perpendicular to the first main surface is a first end surface, and one surface perpendicular to the first main and end surfaces is a bottom surface. The first electrode includes a first bottom surface electrode portion and a first end surface electrode portion. A size of the first bottom surface electrode portion in a direction perpendicular to the bottom surface is a thickness, and a portion of the first bottom surface electrode portion farthest from the first end surface is a leading end. The thickness of at least part of the first bottom surface electrode portion including the leading end decreases toward the leading end.

Abstract: Described is a power transmission gate which includes a charge pump, an NMOS transistor, and a gate driver circuit configured to power (or bias or “drive”) a gate of the NMOS transistor. With this arrangement, a power transmission gate capable of achieving substantially the same resistance provided by prior art power transmission gates while having a footprint of just over one NMOS size unit is provided.

Abstract: A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.

Abstract: A soft magnetic material powder includes soft magnetic material particles, the soft magnetic material particles each include a core formed from an Fe-based soft magnetic material and an insulating film covering the surface of the core, and the insulating film contains an inorganic oxide and a water soluble polymer. A magnetic core includes soft magnetic material particles and a binder bonding the soft magnetic material particles to each other, the soft magnetic material particles each include a core containing an Fe-based soft magnetic material and an insulating film covering the surface of the core, and the insulating film contains an inorganic oxide and a water soluble polymer.

Abstract: A module comprises: a wiring board; a first component, a second component and a third component mounted on a first main surface; a shield structure mounted on the first main surface; a first sealing resin that seals the first component and the like; and a shield film that covers an upper surface of the first sealing resin and the like, the shield structure including a top side portion and at least one sidewall portion bent from the top side portion and thus extending therefrom, the top side portion including the top side portion's conductive layer and a magnetic layer therein, the sidewall portion including the sidewall portion's conductive layer therein, the top side portion's conductive layer and the sidewall portion's conductive layer being electrically connected to a ground conductor, the magnetic layer in the top side portion being located over the first component.

Abstract: An acoustic wave device includes a mounting substrate, and an acoustic wave element chip. The mounting substrate includes a first major surface with a bump-mounting electrode land thereon, and a second major surface facing the first major surface. The acoustic wave element chip includes a piezoelectric substrate including a major surface, and a functional electrode and a bump located over the major surface of the piezoelectric substrate. The bump is joined to the bump-mounting electrode land. A heat radiation pattern is located over the first major surface of the mounting substrate and located within a region facing the functional electrode of the acoustic wave element chip. The heat radiation pattern is connected to an internal layer portion of the mounting substrate between the first and second major surfaces, and not electrically connected to the bump-mounting electrode land on the first major surface.

Abstract: An RFIC module is provided that includes a base material having a first face and a second face opposite to each other, an RFIC mounted above the first face of the base material, and RFIC-side terminal electrodes that are formed on the first face of the base material and are connected to the RFIC. An insulator film is formed on the surface of the RFIC-side terminal electrode, and conductor films facing the RFIC-side terminal electrode are formed on the insulator film. Moreover, additional capacitances are formed between the RFIC-side terminal electrodes and the conductor films.

Abstract: Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. A bonding layer is formed on the surface of the substrate. An etch-stop layer is sandwiched between the bonding layer and the back surface of the single crystal piezoelectric plate. A portion of the single crystal piezoelectric plate and the etch-stop layer, but not the bonding layer, forms a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate with interleaved fingers of the IDT disposed on the diaphragm. The etch-stop layer is impervious to an etch process used to form the cavity.

Abstract: Zinc is added to a metal magnetic alloy powder including iron and silicon. An element is formed using this magnetic material, and a coil is formed inside or on the surface of the element.

Abstract: A switch circuit (10) includes: a transistor (T1) switching the conductivity state between a drain terminal (D1) and a source terminal (S1) between being conductive and non-conductive; a transistor (T2) switching the conductivity state between a drain terminal (D2) and a source terminal (S2) between being conductive and non-conductive, the source terminals (S1) and (S2) being connected to a node (N1) and an input/output terminal (120), respectively, and the drain terminals (D1) and (D2) being connected to an input/output terminal (110) and the node (N1) respectively; a transistor (T3) switching the conductivity state between a drain terminal (D3) and a source terminal (S3) between being conductive and non-conductive, the drain terminal (D3) and the source terminal (S3) being arranged along a second path connecting the node (N1) and ground; and a capacitor (C1) placed in the second path and connected in series to the transistor (T3).

Abstract: A metal magnetic particle provided with an oxide layer on a surface of an alloy particle containing Fe and Si. The oxide layer has a first oxide layer, a second oxide layer, a third oxide layer, and a fourth oxide layer. Also, in line analysis of element content by using a scanning transmission electron microscope-energy dispersive X-ray spectroscopy, the first oxide layer is a layer where Fe content takes a local maximum value, the second oxide layer is a layer where Fe content takes a local maximum value, the third oxide layer is a layer where Si content takes a local maximum value, and the fourth oxide layer is a layer where Fe content takes a local maximum value.

Abstract: A pressure wave generating element is provided that includes a support and a heat generating layer that is provided on the support and generates heat by energization. Moreover, the heat generating layer includes a fiber with at least a partial metal coating on a surface.

Abstract: An acoustic resonator is fabricated by forming a patterned first photoresist mask on a piezoelectric plate at locations of a desired interdigital transducer (IDT) pattern. An etch-stop layer is then deposited on the plate and first photoresist mask. The first photoresist mask is removed to remove parts of the etch-stop and expose the plate. An IDT conductor material is deposited on the etch stop and the exposed plate. A patterned second photoresist mask is then formed on the conductor material at locations of the IDT pattern. The conductor material is then etched over and to the etch-stop to form the IDT pattern which has interleaved fingers on a diaphragm to span a substrate cavity. A portion of the plate and the etch-stop form the diaphragm. The etch-stop and photoresist mask are impervious to this etch. The second photoresist mask is removed to leave the IDT pattern.