Abstract: A photosensitive paste contains an inorganic powder containing an element that forms a polyvalent metal ion; an alkali-soluble polymer; a photosensitive monomer, and a photoinitiator. A dispersion of 1 wt % of the inorganic powder containing an element that forms a polyvalent metal ion in pure water has a conductivity of 170 mS/m or less at 10 minutes after dispersion.

Abstract: A ring-type device includes a wireless power receiver circuit, a radio communication circuit, and a ring-shaped structure. The wireless power receiver circuit includes a power receiver circuit, and a loop coil. The radio communication circuit operates with the loop coil serving as an antenna. The power receiver circuit and the radio communication circuit include an electronic component, and a flexible circuit board to which the electronic component is mounted. The ring-shaped structure has a lateral ring face, a top ring face, and a bottom ring face. The loop coil is disposed along the top ring face. The flexible circuit board is planar in structure in its developed condition, and is disposed in a curved configuration along the lateral ring face of the ring-shaped structure.

Abstract: A radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. The second electronic component and the first connection terminal are disposed on a second main surface of the mounting substrate. The second connection terminal is connected to the first connection terminal, and is disposed on a side of the first connection terminal opposite to the mounting substrate side. The first resin layer covers at least a part of the second electronic component, and covers at least a part of the first connection terminals. The second resin layer is disposed on the first resin layer, and covers at least a part of the second connection terminal. The second connection terminal is located inside the first connection terminal in a plan view in a thickness direction of the mounting substrate.

Abstract: A winding core includes, for example, four planes, that is, a top surface, a bottom surface, a first side surface, and a second side surface around its central axis. A first wire and a second wire are wound around the winding core in the same direction and have a twisted section. In the twisted section in a plurality of turns at the top surface, bottom surface, first side surface, and second side surface, both the first wire and the second wire are in close contact with each of the ridges between the top surface, bottom surface, first side surface, and second side surface.

Abstract: An element assembly has a structure in which insulator layers including first and second insulator layers are laminated in an up-down direction. The first insulator layer is above the second insulator layer. A radiant conductor layer is on an upper surface of the first insulator layer. A first capacitance defining portion includes a first interlayer connection conductor passing through one or more of the insulator layers in the up-down direction. The first interlayer connection conductor is electrically connected to the radiant conductor layer. The radiant conductor layer, a ground conductor, and the first capacitance defining portion define and function as a patch antenna. When the first interlayer connection conductor is electrically connected to the radiant conductor layer, a distance from a lower end of the first interlayer connection conductor to the ground conductor in the up-down direction is shorter than a distance from the radiant conductor layer to the ground conductor in the up-down direction.

Abstract: An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.

Abstract: A microelectromechanical structure including a first wafer structure attached by bonding to a second wafer structure. The first wafer structure includes a build part of silicon wafer material, a through via, and an isolation structure separating the through via from the build part. The through via extends between a first electrical contact and a second electrical contact through the first wafer structure in a first direction. The first electrical contact of the first wafer structure is accessible externally and the second electrical contact of the first wafer structure connects to an internal electrical contact on the second wafer structure. In the first direction, the extent of the isolation structure includes a hollow section and a via fill section where the isolation structure is filled with solid electrically insulating material. enables considerable increase of gap height in MEMS structures.

Abstract: A conductive film that includes: particles of a layered material including one or more layers, wherein each of the one or more layers includes a layer body represented by: MmXn, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, m is greater than n and 5 or less, a modification or termination T is present on a surface of the layer body, where the T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom; and a phosphorus atom in an amount of 0.001% by mass to less than 0.09% by mass.

Abstract: A magnetic sensor chip includes a substrate including a first main surface, and a magnetoresistive element having a magnetosensitive direction parallel or substantially parallel to the first main surface. The magnetoresistive element includes a reference layer, an intermediate layer, and a free layer stacked in a stacking direction perpendicular or substantially perpendicular to the first main surface. A direction of magnetic anisotropy of the free layer where no external magnetic field acts on the magnetic sensor chip is parallel or substantially parallel to the stacking direction and perpendicular or substantially perpendicular to the magnetosensitive direction. When a stress acts on the substrate predominantly in a first direction parallel or substantially parallel to the first main surface, a direction of stress-induced magnetic anisotropy in the free layer is perpendicular or substantially perpendicular to the magnetosensitive direction and the stacking direction.

Abstract: A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.

Abstract: The present invention relates to a method and an apparatus for detecting a failure of a sensor device during operation of the sensor device. A test signal is generated in a first frequency band that is above a signal frequency band of the sensor device and fed into a sensor element of the sensor device. A set of samples is obtained, and a magnitude value is derived from said at least two consecutive samples at the first frequency band. The magnitude value is compared to a magnitude threshold value that defines a minimum for the magnitude value and if the magnitude value is below the magnitude threshold value, it is determined that an error has occurred in the sensor device.

Abstract: A coil component includes an element body including a first glass layer, a first ferrite layer formed on a first main surface of the first glass layer, and a second ferrite layer formed on a second main surface of the first glass layer; a coil buried in the first glass layer; and an outer electrode disposed on a side surface of the element body so as to span the first ferrite layer, the first glass layer, and the second ferrite layer. On the side surface of the element body, the width of the outer electrode in the ferrite layer regions is larger than the width of the outer electrode in the glass layer region in plan view in the direction perpendicular to the side surface.

Abstract: A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.

Abstract: A planar array coil includes a multilayer substrate at which a plurality of coils are formed and arranged on a plane of the multilayer substrate. First ends of the plurality of coils are connected to switching circuit units of a power conversion circuit, and second ends of the plurality of coils are connected to a common output part. The coils include two coil parts in which currents flow in opposite rotation directions, and one coil part of one coil is adjacent to one coil part of another coil. The plurality of coils are connected such that operation of switching circuits causes currents in regions of adjacent coil parts that extend in parallel to each other to flow in the same direction. Accordingly, adverse effects by unwanted coupling between adjacent coils are reduced and a switching power supply device that includes the planar array coil performs stable power conversion operations.

Abstract: A power amplifier device includes a semiconductor substrate; a plurality of first transistors that are provided on the semiconductor substrate and receive input of a radio-frequency signal; a plurality of second transistors that are provided on the semiconductor substrate and electrically connected to the respective plurality of first transistors, and output a radio-frequency output signal obtained by amplifying the radio-frequency signal; a plurality of first bumps provided so as to overlay the respective plurality of first transistors; and a second bump provided away from the plurality of first bumps and provided so as not to overlay the plurality of first transistors and the plurality of second transistors. When viewed in plan from a direction perpendicular to a surface of the semiconductor substrate, a first transistor and a first bump, a second transistor, the second bump, a second transistor, and a first transistor and a first bump are arranged in sequence.

Abstract: A semiconductor devices comprises a first member including a first circuit partially formed by an elemental semiconductor element at a surface layer, a first conductive raised portion at the first member, and a second member smaller than the first member in plan view joined to the first member. The second member includes a second circuit partially formed by a compound semiconductor element. A second conductive raised portion is at the second member. A power amplifier includes a first-stage amplifier circuit included in the first or second circuit and a second-stage amplifier circuit included in the second circuit. The first circuit includes a first switch for inputting to the first-stage amplifier circuit a radio-frequency signal inputted to a selected contact, a control circuit to control the first- and second-stage amplifier circuits, and a second switch for outputting from a selected contact a radio-frequency signal outputted by the second-stage amplifier circuit.

Abstract: An acoustic wave device in which a cavity defining an acoustic reflector is formed on a first main surface side of a substrate, an excitation portion is structured above the cavity in a manner that a first electrode, a piezoelectric thin film, and a second electrode are laminated, and a periodic pattern is provided in a normal direction of a side of the excitation portion on at least one of a first extraction electrode and a second extraction electrode.

Abstract: A power amplifier module includes a first power amplifier that amplifies an input signal and outputs a first transmission signal; a first switch circuit that receives input of the first transmission signal and performs switching to, of a plurality of signal paths, a signal path through which the first transmission signal passes; and a second switch circuit that receives input of the first transmission signal output from the first switch circuit through the signal path to which the first switch circuit has performed switching and switches between signal paths to an antenna terminal. The second switch circuit includes a power supply circuit that supplies a reference voltage to the first switch circuit and the second switch circuit.

Abstract: A vibration unit includes a light transmitting member including at least a portion of a detection region of an imaging element, and a vibration element including a vibrating body coupled to the light transmitting member. The light transmitting member includes a central region and a peripheral region located around the central region. The light transmitting member includes a hydrophilic film in the peripheral region thereof.

Abstract: A radio-frequency module (1) includes a module substrate (70) having major surfaces (701 and 702) opposite to each other, external connection terminals (90a and 90b) disposed on the major surface (702), a power amplifier (11) having major surfaces (111 and 112) opposite to each other and being disposed on the major surface (702) such that the major surface (111) is a mounting surface on the module substrate (70), a bonding wire (45) coupled to the major surface (112), and a heat dissipation electrode (91) disposed apart from the power amplifier (11) on the major surface (112) side with respect to the power amplifier (11) and coupled to the bonding wire (45).