Patents Assigned to Murata Manufacturing Co., Ltd.
  • Patent number: 11031921
    Abstract: The acoustic wave filter (10A) includes a parallel-arm resonant circuit (12p). The parallel-arm resonant circuit (12p) includes a parallel-arm resonator (p1) and a frequency variable circuit (72p) that are connected in parallel. The frequency variable circuit (72p) includes a parallel-arm resonator (p2) that has a resonant frequency higher than that of the parallel-arm resonator (p1) and a switch (SW1) element. A frequency difference between a resonant frequency on a higher frequency side of the parallel-arm resonant circuit (12p) in a case where the switch (SW1) is OFF and a resonant frequency on a higher frequency side of the parallel-arm resonant circuit (12p) in a case where the switch (SW1) is ON is equal to or more than a frequency difference between a low frequency end frequency of the second attenuation band and a low frequency end frequency of the first attenuation band.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: June 8, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Koji Nosaka
  • Patent number: 11032904
    Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: June 8, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirokazu Yazaki, Keito Yonemori, Takanori Tsuchiya, Koji Kamada, Takashi Noma
  • Patent number: 11031910
    Abstract: A power amplifier module includes a power amplifier circuit and a control IC. The power amplifier circuit includes a bipolar transistor that amplifies power of an RF signal and outputs an amplified signal. The control IC includes an FET, which serves as a bias circuit that supplies a bias signal to the bipolar transistor. The FET is operable at a threshold voltage lower than that of the bipolar transistor, thereby making it possible to decrease the operating voltage of the power amplifier module.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 8, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shota Ishihara, Yasuhisa Yamamoto
  • Patent number: 11031700
    Abstract: An antenna module (10) includes a dielectric substrate (110), patch antennas (100) that are disposed at locations near a first main surface of the dielectric substrate (110), a RFIC (30) that is mounted at a location near a second main surface of the dielectric substrate (110) opposite the first main surface and that is electrically connected to the patch antennas (100), and an identification mark (50) that is located in an antenna arrangement area that is an area of the dielectric substrate (110) except for an outer circumferential area in which the patch antennas (100) are not arranged. The identification mark (50) is located in the antenna arrangement area so as not to overlap feed points (115) with which the respective patch antennas (100) are provided in a plan view of the first main surface.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: June 8, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Saneaki Ariumi
  • Patent number: 11031920
    Abstract: A radio-frequency filter (10) includes a series arm circuit (11) and a parallel arm circuit (12). The series arm circuit (11) is disposed on a path connecting an input/output terminal (11m) and an input/output terminal (11n). The parallel arm circuit (12) is connected to a ground and to a node (x1) on the path. The series arm circuit (11) includes a series connecting circuit (11e) and a first variable frequency circuit (11a). The series connecting circuit (11e) includes a series arm resonator (s1) and a capacitor (C1). The first variable frequency circuit (11a) is connected in parallel with the series connecting circuit (11e) and varies the anti-resonant frequency of the series arm circuit (11). The first variable frequency circuit (11a) includes a capacitor (C2) and a switch (SW1) connected in series with each other. The series arm resonator (s1) and the capacitor (C1) are connected in series with each other.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: June 8, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Koji Nosaka
  • Patent number: 11031860
    Abstract: A converter with soft start includes a transformer; first and second switches connected to the transformer to supply power to the transformer; a controller connected to the first and second transistors and arranged to, during startup of the converter, switch the first switch with a variable duty cycle and switch the second switch with either a fixed duty cycle or a variable duty cycle with pulses larger than pulses of the variable duty cycle of the first switch; and a bleed device arranged to set initial conditions of the converter before startup of the converter by discharging a capacitor in the converter before startup.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: June 8, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Bing Gong, Jahangir Afsharian
  • Publication number: 20210166854
    Abstract: A coil component includes an element body including a first glass layer, a first ferrite layer formed on a first main surface of the first glass layer, and a second ferrite layer formed on a second main surface of the first glass layer; a coil buried in the first glass layer; and an outer electrode disposed on a side surface of the element body so as to span the first ferrite layer, the first glass layer, and the second ferrite layer. On the side surface of the element body, the width of the outer electrode in the ferrite layer regions is larger than the width of the outer electrode in the glass layer region in plan view in the direction perpendicular to the side surface.
    Type: Application
    Filed: October 29, 2020
    Publication date: June 3, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kouhei MATSUURA, Morihiro HAMANO
  • Publication number: 20210167803
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission input terminal; a first transmission amplifier disposed on the first principal surface that amplifies a transmission signal input through the transmission input terminal; and a first switch disposed on the second principal surface that connects and disconnects the transmission input terminal and the first transmission amplifier.
    Type: Application
    Filed: November 27, 2020
    Publication date: June 3, 2021
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kunitoshi HANAOKA, Yoichi SAWADA
  • Publication number: 20210166864
    Abstract: An electronic component includes an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and an external electrode is provided in the element body. In a first cross-section intersecting with the two end surfaces and the bottom surface of the element body, the external electrode has a first portion extending along a first surface that is one of the end surface and the bottom surface of the element body. The coil is disposed such that an outer circumferential edge of the coil faces the first surface of the element body. A shortest distance between the outer circumferential edge of the coil and the first surface of the element body is smaller than a minimum width of the first portion in a direction orthogonal to the first surface.
    Type: Application
    Filed: February 3, 2021
    Publication date: June 3, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yuta SHIMODA, Mitsuru YAMAUCHI
  • Patent number: 11023069
    Abstract: A pressure sensor that includes a piezoelectric film having a flat part and a curved part and having opposed first and second main surfaces, a first electrode on the first main surface of the piezoelectric film, and a second electrode on the second main surfaces of the piezoelectric film. When the flat part of the piezoelectric film receives a pressing operation a first output is generated, and when the curved part of the piezoelectric film receives a pressing operation a second output different from the first output is generated.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidekazu Kano, Hiroaki Kitada, Shiori Nagamori
  • Patent number: 11024459
    Abstract: A method of manufacturing a coil component including a step of welding a wire to a metal terminal by laser welding capable of making positional displacement of the wire only minimally occur. As a metal terminal, a metal terminal having a connecting portion on which a positioning groove for receiving and positioning a portion of the wire is formed is prepared. The wire is temporarily fixed to the connecting portion in a state where the wire is positioned by being fitted in the positioning groove, and the wire and the metal terminal are welded to each other by irradiating a laser beam. The positioning groove is preferably formed into a V shape in cross section.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Murakami, Akio Igarashi, Koji Onishi
  • Patent number: 11024456
    Abstract: When a winding density represents the number of turns of a wire per unit length in a longitudinal direction of a core portion, a plurality of inductor regions having mutually different winding densities of the wire are arrayed in the longitudinal direction of the core portion, and a low-density inductor region with the winding density being relatively low is located between first and second high-density inductor regions with the winding densities being relatively high.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: June 1, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masashi Miyamoto
  • Patent number: 11024571
    Abstract: A coil built-in multilayer substrate includes a multilayer substrate, a coil, interlayer connection conductors, and gaps. The multilayer substrate includes a magnetic layer, a component-mounting land conductor provided on a first principal surface, and a terminal conductor provided on a second principal surface. The coil is provided in the magnetic layer and includes an axis extending in a direction perpendicular or substantially perpendicular to the first and second principal surfaces. The interlayer connection conductors are provided in the magnetic layer in a region inside the spiral coil. Gaps penetrate lateral surfaces of the interlayer connection conductors.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Keito Yonemori
  • Patent number: 11024955
    Abstract: An antenna module includes a dielectric substrate, a radiation electrode formed on the front face of the dielectric substrate, an RFIC and a ground electrode formed on the rear face of the dielectric substrate, a ground line arranged in the dielectric substrate, and a power supply line including a power supply line portion arranged in parallel to a main surface of the dielectric substrate. The ground electrode is arranged between the power supply line portion and the RFIC. The ground line is arranged between the power supply line portion and the radiation electrode. The ground electrode includes the radiation electrode and part of the power supply line portion in a plan view. The ground line includes part of the power supply line portion in the plan view. The area in which the ground line is formed is smaller than the area in which ground electrode is formed.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kengo Onaka, Yoshiki Yamada, Hirotsugu Mori
  • Patent number: 11024965
    Abstract: The dual-band antenna device includes: a feeding electrode that branches into a first branch feeding electrode that serves as a low-frequency signal path and a second branch feeding electrode that serves as a high-frequency signal path; and a radiation electrode having a rectangular shape with a longitudinal direction and having a low-frequency feeding point to which the first branch feeding electrode is electrically connected and a high-frequency feeding point to which the second branch feeding electrode is electrically connected. In the radiation electrode, the low-frequency feeding point or the high-frequency feeding point is formed close to an end portion of the rectangular shape in the longitudinal direction, and the high-frequency feeding point or the low-frequency feeding point is formed at a center portion of a side of the rectangular shape that extends in the longitudinal direction.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Ryo Komura
  • Patent number: 11025227
    Abstract: A first filter of a multiplexer includes serial resonators and parallel resonators that are acoustic wave resonators. A first of the serial resonators that is closer to a common terminal than the other serial resonators is connected to the common terminal without the parallel resonators interposed therebetween. Each of the elastic wave resonators includes a substrate having piezoelectricity, an IDT electrode provided on the substrate, and a dielectric layer provided on the substrate to cover the IDT electrode. A thickness of the dielectric layer of the first serial resonator is smaller than a thickness of each of the dielectric layers of the remainder of the elastic wave resonators.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuharu Nakai, Katsuya Daimon
  • Patent number: 11025221
    Abstract: An acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. In the IDT electrode, a central region, first and second low acoustic velocity regions and first and second high acoustic velocity regions are disposed in this order. A duty ratio in the first low acoustic velocity region of first electrode fingers and the second low acoustic velocity region of second electrode fingers is larger than a duty ratio in the central region. When acoustic velocity of a transversal bulk wave propagating in metal that is a main component of a main electrode layer is defined as v (m/s), v?3299 m/s, and when a wave length defined by an electrode finger pitch of the IDT electrode is defined as ?, and a film thickness of the main electrode layer normalized by the wave length ? is defined as T, then T?0.00018e0.002V+0.014.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu Mimura, Kazuhiro Takigawa
  • Patent number: 11024882
    Abstract: A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution including at least one of sulfonyl compounds expressed by R(—S(?O)2—Rf)n, where R represents an n-valent hydrocarbon group including one or two or more aliphatic hydrocarbon rings, Rf includes one of a halogen group and a monovalent halogenated hydrocarbon group, n is an integer greater than or equal to 1.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: June 1, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Katsuaki Kawasumi, Toru Odani, Kazumasa Takeshi
  • Patent number: 11024451
    Abstract: A multilayer coil component includes coil conductors including silver planar conductors and ferrite layers containing copper and stacked with the coil conductors and the planar conductors interposed therebetween. The coil conductors define a portion of a coil with a winding axis extending in a lamination direction. The planar conductors are arranged in the lamination direction at a position on an upper side of the coil so that each of principal surfaces thereof faces in the lamination direction and a specific region of the principal surface overlaps with the coil when viewed from the lamination direction. Each of the planar conductors includes first through holes penetrating the principal surface in the lamination direction in the specific region.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tomoya Yokoyama, Takayuki Okada
  • Patent number: 11022439
    Abstract: The disclosure relates to a microelectromechanical gyroscope which comprises first and second proof masses which form a first proof mass pair and third and fourth proof masses which form a second proof mass pair. The oscillation of the first and second proof mass pairs is synchronized by a synchronization element which comprises a ringlike body and torsion bars which extend along the x-axis from the ringlike body to the first, second, third and fourth proof masses.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Heikki Kuisma, Anssi Blomqvist, Ville-Pekka Rytkönen