Connector

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Description

FIG. 1 is a front elevational view of a connector showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a front, top, and right side perspective view thereof;

FIG. 8 is a rear, bottom, and left side perspective view thereof;

FIG. 9 is a front, right, and bottom side perspective view thereof; and,

FIG. 10 is a rear, left, and top side perspective view thereof.

The broken line showing of the connector is for the purpose of illustrating portions of the article and forms no part of the claimed design.

Claims

The ornamental design for a connector as shown and described.

Referenced Cited
U.S. Patent Documents
3131017 April 1964 Mittler
D327252 June 23, 1992 Moriai
D451885 December 11, 2001 Hisatomi
D539747 April 3, 2007 Igarashi
D606943 December 29, 2009 Ohshima
9985366 May 29, 2018 Takeuchi
D870048 December 17, 2019 Morita
20050009379 January 13, 2005 Huang
20190214762 July 11, 2019 Morita
20190334267 October 31, 2019 Hashiguchi
20230327375 October 12, 2023 Chen
Other references
  • ACES BTB plug connector, posted Sep. 30, 2020 [online], [retrieved Apr. 15, 2025]. Retrieved from internet, https://www.acesconn.com/series/51080-XXXXX-XXX/2884 (Year: 2020).
  • Kyocera AVX connector, posted Jun. 18, 2023 [online], [retrieved Apr. 15, 2025]. Retrieved from internet, https://www.digikey.com/en/products/detail/kyocera-avx/145655040000829-T/12323166?gclsrc=aw.ds&&utm_adgroup=&utm_source=google&utm_medium=cpc&utm_campaign=PmaX_Shopping_Supplier_Kyocera%20AVX_0478_Coop (Year: 2023).
  • Kyocera dual entry card edge connector, posted Nov. 6, 2024 [online], [retrieved Apr. 15, 2025]. Retrieved from internet, https://www.kyocera-avx.com/products/connectors/board-to-board/perpendicular-motherdaughter/9159-800-series/ (Year: 2024).
  • Samtec edge rate board to board, posted Feb. 16, 2024 [online], [retrieved Apr. 15, 2025]. Retrieved from internet, https://www.electronicproducts.com/board-to-board-connectors-getthinner/ (Year: 2024).
Patent History
Patent number: D1082715
Type: Grant
Filed: Jun 22, 2023
Date of Patent: Jul 8, 2025
Assignee: Japan Aviation Electronics Industry, Limited (Tokyo)
Inventor: Yohei Yokoyama (Tokyo)
Primary Examiner: George D. Kirschbaum
Assistant Examiner: Denis Houyoux
Application Number: 29/895,500