Laser processing machine
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Description
The broken lines showing of the laser processing machine is included for the purpose of illustrating portions of the laser processing machine and forms no part of the claimed design.
Claims
The ornamental design for a laser processing machine as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1088076
Type: Grant
Filed: Oct 30, 2024
Date of Patent: Aug 12, 2025
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Ian Emerson Random (Tokyo), Shinichi Kato (Tokyo), Yoshiharu Kurosaki (Tokyo)
Primary Examiner: Richard Edgar
Assistant Examiner: Cheng Chen
Application Number: 29/970,780
Type: Grant
Filed: Oct 30, 2024
Date of Patent: Aug 12, 2025
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Ian Emerson Random (Tokyo), Shinichi Kato (Tokyo), Yoshiharu Kurosaki (Tokyo)
Primary Examiner: Richard Edgar
Assistant Examiner: Cheng Chen
Application Number: 29/970,780
Classifications