Spring module
Description
Claims
The ornamental design for a spring module, as shown and described.
Referenced Cited
U.S. Patent Documents
| 1284384 | November 1918 | Lewis |
| 3430275 | March 1969 | Janapol |
| 4895352 | January 23, 1990 | Stumpf |
| 5632473 | May 27, 1997 | Dias Magalhaes Queiroz |
| 20070022538 | February 1, 2007 | Zschoch |
| 20100301531 | December 2, 2010 | Delahousse |
| 20130031726 | February 7, 2013 | Demoss |
| 20140373282 | December 25, 2014 | Mossbeck |
| 20210068553 | March 11, 2021 | Nygren |
| 20220049733 | February 17, 2022 | Spickenheier |
| 20240215733 | July 4, 2024 | Leng |
| 20240298811 | September 12, 2024 | Leng |
| 20240423382 | December 26, 2024 | Leng |
Patent History
Patent number: D1091291
Type: Grant
Filed: Sep 5, 2023
Date of Patent: Sep 2, 2025
Assignee: New-Tec Integration (Xiamen) Co., Ltd. (Xiamen)
Inventor: Luhao Leng (Xiamen)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Benjamin L. Gray
Application Number: 29/901,791
Type: Grant
Filed: Sep 5, 2023
Date of Patent: Sep 2, 2025
Assignee: New-Tec Integration (Xiamen) Co., Ltd. (Xiamen)
Inventor: Luhao Leng (Xiamen)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Benjamin L. Gray
Application Number: 29/901,791
Classifications
Current U.S. Class:
D6/606