Spring module
Description
Claims
The ornamental design for a spring module, as shown and described.
Referenced Cited
U.S. Patent Documents
| 1253272 | January 1918 | Nachman |
| 4485506 | December 4, 1984 | Stumpf |
| 12137813 | November 12, 2024 | Jewett |
| 20230200553 | June 29, 2023 | Leng |
| 20240298811 | September 12, 2024 | Leng |
| 20240315464 | September 26, 2024 | Leng |
| 20240365992 | November 7, 2024 | Leng |
| 20250176733 | June 5, 2025 | Leng |
| 20250194816 | June 19, 2025 | Nygren |
Patent History
Patent number: D1099607
Type: Grant
Filed: Oct 10, 2023
Date of Patent: Oct 28, 2025
Assignee: New-Tec Integration (Xiamen) Co., Ltd. (Xiamen)
Inventor: Luhao Leng (Xiamen)
Primary Examiner: George A Bugg
Assistant Examiner: Carrie A Matteoli
Application Number: 29/904,686
Type: Grant
Filed: Oct 10, 2023
Date of Patent: Oct 28, 2025
Assignee: New-Tec Integration (Xiamen) Co., Ltd. (Xiamen)
Inventor: Luhao Leng (Xiamen)
Primary Examiner: George A Bugg
Assistant Examiner: Carrie A Matteoli
Application Number: 29/904,686
Classifications
Current U.S. Class:
D6/718.31