Earbuds case

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Description

FIG. 1 is a top perspective view of an earbuds case;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The dashed broken lines depict portions of the earbuds case that form no part of the claimed design.

Claims

The ornamental design for an earbuds case, as shown and described.

Referenced Cited
U.S. Patent Documents
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Foreign Patent Documents
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Other references
  • Apple AirPods Pro, announced Oct. 28, 2019 [online], [site visited Sep. 20, 2021]. Available from internet, URL: <https://www.amazon.com/Apple-MWP22AM-A-AirPods-Pro/dp/B07ZPC9QD4/> (Year: 2019).
  • Chinese Office Action mailed Jun. 8, 2021 for Chinese Patent Application No. 202030718890.6, a counterpart foreign application of U.S. Appl. No. 29/735,880, 1 page.
  • I Luv TB100 Wireless Earbuds, announced Dec. 19, 2019 [online], [site visited Sep. 20, 2021 ]. Available from internet, URL: https://www.amazon.com/Hands-Free-Microphone-Waterproof-Protection-H igh-Fidelity/dp/B082XGZ455/?th = 1 > (Year: 2019).
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  • “Wireless Stereo Inside Phone RZ-S50W Product Overview”, retrieved from <<https://panasonic.jp/headphone/p-db/RZ-S50W.html>>, 3 pages A design of wireless earphone case (Publicly known design No. RJ02009617 of Japan Patent Office).
Patent History
Patent number: D1107428
Type: Grant
Filed: Aug 22, 2024
Date of Patent: Dec 30, 2025
Assignee: Amazon Technologies, Inc. (Seattle, WA)
Inventors: Emmanuel Laffon de Mazieres (San Jose, CA), Giles David Matthew McWilliam (San Francisco, CA)
Primary Examiner: Kevin K Rudzinski
Assistant Examiner: Amber J Rabie
Application Number: 29/958,984
Classifications
Current U.S. Class: D3/294