Liquid precision discharge machine

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Description

FIG. 1 is a front view thereof, showing a liquid precision discharge machine of my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is an oblique view thereof;

In the drawings, the broken lines depict portions of the liquid precision discharge machine that form no part of the claimed design. The single dotted line indicates only the boundary between the claimed portions and the unclaimed portions.

This article is a device to dispense liquid materials such as cream solder, silver paste, epoxy resin, and liquid crystal materials at high speed and with high accuracy onto surfaces such as electronic substrates, glass substrates, and wafers.

Claims

The ornamental design for a liquid precision discharge machine, as shown and described.

Referenced Cited
U.S. Patent Documents
D336749 June 22, 1993 Lenard
D375606 November 12, 1996 Dallman
D658217 April 24, 2012 Wenning
D731566 June 9, 2015 Shimano
D732587 June 23, 2015 Hsu
D742945 November 10, 2015 Lee
D781357 March 14, 2017 Inaba
D801401 October 31, 2017 Clark, III
D807956 January 16, 2018 Brown
D816128 April 24, 2018 Albrecht
D905139 December 15, 2020 Ferraro
D952718 May 24, 2022 Ohshiro
D979616 February 28, 2023 Ferraro
D985026 May 2, 2023 Li
D1002683 October 24, 2023 Meling
D1072003 April 22, 2025 Hertel
D1096268 October 7, 2025 Huang
Patent History
Patent number: D1110373
Type: Grant
Filed: Jun 23, 2023
Date of Patent: Jan 27, 2026
Assignee: MUSASHI ENGINEERING, INC. (Tokyo)
Inventor: Kazumasa Ikushima (Tokyo)
Primary Examiner: Mark T. Philipps
Application Number: 29/878,527