Board with embossed pattern

- Wiwynn Corporation
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Description

FIG. 1 is a top, front, right side perspective view of a board with embossed pattern, showing our new design;

FIG. 2 is a bottom, rear, left side perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged detail view of area 9 of FIG. 1; and,

FIG. 10 is an enlarged detail view of area 10 of FIG. 2.

The broken lines in the drawings depict portions of the board with embossed pattern that form no part of the claimed design. The dot-dash broken lines in the drawings depict the boundaries of the enlarged detail areas and form no part of the claimed design.

Claims

The ornamental design for a board with embossed pattern, as shown and described.

Referenced Cited
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Other references
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Patent History
Patent number: D1111478
Type: Grant
Filed: Jun 26, 2024
Date of Patent: Feb 10, 2026
Assignee: Wiwynn Corporation (New Taipei)
Inventors: Chien-Yun Hsu (New Taipei), Yung-Ti Chung (New Taipei), Jheng-Ying Jiang (New Taipei)
Primary Examiner: Kevin K Rudzinski
Assistant Examiner: Joseph J. Seddon
Application Number: 29/949,429
Classifications
Current U.S. Class: D5/53; D5/59