Embedding module
Description
The broken lines in the figures illustrate portions of the embedding module that form no part of the claimed design.
Claims
The ornamental design for a embedding module, as shown and described.
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Patent History
Patent number: D1114290
Type: Grant
Filed: Jun 21, 2024
Date of Patent: Feb 17, 2026
Assignee: Sakura Medical Science Technology (Taizhou) Co., Ltd. (Taizhou)
Inventors: Wei Zhang (Beijing), Takeshi Funaya (Beijing), Jun Jin (Beijing)
Primary Examiner: T Chase Nelson
Assistant Examiner: Kelly L Gross
Application Number: 29/948,634
Type: Grant
Filed: Jun 21, 2024
Date of Patent: Feb 17, 2026
Assignee: Sakura Medical Science Technology (Taizhou) Co., Ltd. (Taizhou)
Inventors: Wei Zhang (Beijing), Takeshi Funaya (Beijing), Jun Jin (Beijing)
Primary Examiner: T Chase Nelson
Assistant Examiner: Kelly L Gross
Application Number: 29/948,634
Classifications
Current U.S. Class:
Specimen Handling, Preparation Or Testing (62) (D24/216)