Cooling system for a computer

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Description

FIG. 1 is an isometric view of a top, rear, and right side of an ornamental design for a cooling system for a computer, showing environmental structure of a cooling system in dash-dash-dash lines;

FIG. 2 is an isometric view of a top, rear, and right side of the cooling system for a computer of FIG. 1 with the dash-dash-dash lines depicting environmental structure of a cooling system removed for clarity;

FIG. 3 is a rear elevational view of the cooling system for a computer of FIG. 2;

FIG. 4 is a front elevational view of the cooling system for a computer of FIG. 2;

FIG. 5 is a top plan view of the cooling system for a computer of FIG. 2;

FIG. 6 is a bottom plan view of the cooling system for a computer of FIG. 2;

FIG. 7 is a left side elevational view of the cooling system for a computer of FIG. 2;

FIG. 8 is a right side elevational view of the cooling system for a computer of FIG. 2;

FIG. 9 is an exploded, isometric view of a top, rear, and right side of the cooling system for a computer of FIG. 2; and,

FIG. 10 is an exploded, isometric view of a top, front, and left side of the cooling system for a computer of FIG. 2.

The broken lines showing a radiator and tubing in FIG. 1 depict environmental structure that forms no part of the claimed design. All other broken lines depict portions of the cooling system for a computer that form no part of the claimed design.

Claims

The ornamental design for a cooling system for a computer, as shown and described.

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Patent History
Patent number: D1125093
Type: Grant
Filed: Jul 22, 2024
Date of Patent: May 5, 2026
Assignee: Hewlett-Packard Development Company, Ltd. (Spring, TX)
Inventors: Daniel Young Yoon (Palo Alto, CA), Glenn A. Wong (Palo Alto, CA)
Primary Examiner: Amanda Christensen
Application Number: 29/953,433
Classifications
Current U.S. Class: Heat Sink (D13/179)