Heat curing board

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Description

FIG. 1 is a perspective view of a heat curing board showing our new design.

FIG. 2 is a front view thereof.

FIG. 3 is a rear view thereof.

FIG. 4 is a left side view thereof.

FIG. 5 is a right side view thereof.

FIG. 6 is a top view thereof.

FIG. 7 is a bottom view thereof.

FIG. 8 is a left, bottom perspective view thereof.

FIG. 9 is an enlarged detail view of area 9 shown in FIG. 1.

FIG. 10 is an enlarged detail view of area 10 shown in FIG. 2; and,

FIG. 11 is an enlarged detail view of area 11 shown in FIG. 6.

Claims

The ornamental design for a heat curing board, as shown and described.

Referenced Cited
U.S. Patent Documents
D731666 June 9, 2015 Chandler
D791335 July 4, 2017 Buchanan
D938844 December 21, 2021 Augustine
D1016262 February 27, 2024 Chen
D1016263 February 27, 2024 Chen
D1059560 January 28, 2025 Meng
D1059942 February 4, 2025 Wu
D1076572 May 27, 2025 Zhang
D1085800 July 29, 2025 Li
D1086245 July 29, 2025 McQuerry
D1089587 August 19, 2025 Wu
20140074196 March 13, 2014 Barnett
20150021313 January 22, 2015 Chang
20160302262 October 13, 2016 Hsu
20210321493 October 14, 2021 Amoiev
20250058534 February 20, 2025 Chen
Other references
  • Offnova, (date first available Nov. 23, 2024), 2-in-1 Resin Heating Mat & Leveling Table, Amazon.ca, URL: (https://www.amazon.ca/OFFNOVA-Heating-Leveling-Undeformed-Temperature/dp/B0DHH26W67?th=1), (Year: 2024).
Patent History
Patent number: D1126264
Type: Grant
Filed: May 9, 2024
Date of Patent: May 12, 2026
Inventors: Hua Liao (Shenzhen), Ting Xiang (Shenzhen)
Primary Examiner: Richard Edgar
Assistant Examiner: Cheng Chen
Application Number: 29/941,435
Classifications