Heat curing board
Description
Claims
The ornamental design for a heat curing board, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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- Offnova, (date first available Nov. 23, 2024), 2-in-1 Resin Heating Mat & Leveling Table, Amazon.ca, URL: (https://www.amazon.ca/OFFNOVA-Heating-Leveling-Undeformed-Temperature/dp/B0DHH26W67?th=1), (Year: 2024).
Patent History
Patent number: D1126264
Type: Grant
Filed: May 9, 2024
Date of Patent: May 12, 2026
Inventors: Hua Liao (Shenzhen), Ting Xiang (Shenzhen)
Primary Examiner: Richard Edgar
Assistant Examiner: Cheng Chen
Application Number: 29/941,435
Type: Grant
Filed: May 9, 2024
Date of Patent: May 12, 2026
Inventors: Hua Liao (Shenzhen), Ting Xiang (Shenzhen)
Primary Examiner: Richard Edgar
Assistant Examiner: Cheng Chen
Application Number: 29/941,435
Classifications
Current U.S. Class:
Heat Treatment, Welding Or Brazing (D15/144)