Electric soldering iron
Description
The dash-dash broken lines in the drawings depict portions of the electric soldering iron and form no part of the claimed design.
Claims
The ornamental design for an electric soldering iron, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
| D564319 | March 18, 2008 | Tsai |
| D847233 | April 30, 2019 | Gou |
| D847234 | April 30, 2019 | Gou |
| D847235 | April 30, 2019 | Gou |
| D862547 | October 8, 2019 | Xie |
| D865014 | October 29, 2019 | Xu |
| D879169 | March 24, 2020 | Xu |
| D891209 | July 28, 2020 | Gou |
| D935500 | November 9, 2021 | Li |
| D937645 | December 7, 2021 | Gou |
| D949652 | April 26, 2022 | Tian |
| D951049 | May 10, 2022 | Li |
| D951316 | May 10, 2022 | Gou |
| D951317 | May 10, 2022 | Li |
| D955193 | June 21, 2022 | Xu |
| D960674 | August 16, 2022 | Xu |
| D963447 | September 13, 2022 | Li |
| D968919 | November 8, 2022 | Xu |
| D973739 | December 27, 2022 | Bayo |
| D986699 | May 23, 2023 | Gou |
| D1006080 | November 28, 2023 | Ding |
| D1019311 | March 26, 2024 | Wu |
| D1026984 | May 14, 2024 | Roa |
| D1041521 | September 10, 2024 | Li |
| D1041522 | September 10, 2024 | Wu |
| D1042568 | September 17, 2024 | Li |
| D1048839 | October 29, 2024 | Matsuzaki |
| D1058625 | January 21, 2025 | Li |
| D1068893 | April 1, 2025 | Li |
| D1080702 | June 24, 2025 | Wu |
- Aucanla, (date first available May 10, 2024), Cordless Soldering Iron Kit, Amazon.com, URL: (https://www.amazon.com/Soldering-Adjustable-Temperature-392-842%C2%B0F-Rechargeable/dp/B0D3TDD9H2), (Year: 2024).
- Elmconfig, (date first available Mar. 20, 2024), Cordless Soldering Iron Kit, Amazon.com, URL: (https://www.amazon.com/Cordless-Soldering-Rechargeable-Temperature-Adjustment/dp/B0CYLR6ZF4), (Year: 2024).
Patent History
Patent number: D1127023
Type: Grant
Filed: Jun 16, 2025
Date of Patent: May 19, 2026
Inventors: Hongquan Yin (Yantai), Huiting Zhang (Yantai), Changlei Fan (Yantai), Bo Yu (Yantai)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Cheng Chen
Application Number: 30/008,559
Type: Grant
Filed: Jun 16, 2025
Date of Patent: May 19, 2026
Inventors: Hongquan Yin (Yantai), Huiting Zhang (Yantai), Changlei Fan (Yantai), Bo Yu (Yantai)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Cheng Chen
Application Number: 30/008,559
Classifications
Current U.S. Class:
Solid Material Melting, E.g., Solder, Etc. (D15/144.2);
D8/30