Headphone
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Description
The broken lines illustrating portions of the headphone form no part of the claimed design.
Claims
The ornamental design for a headphone as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1131444
Type: Grant
Filed: Mar 5, 2025
Date of Patent: Jun 23, 2026
Assignee: SONY GROUP CORPORATION (Tokyo)
Inventor: Tetsu Sumii (Kanagawa)
Primary Examiner: Michelle E. Wilson
Assistant Examiner: David Michael Sullivan
Application Number: 29/992,053
Type: Grant
Filed: Mar 5, 2025
Date of Patent: Jun 23, 2026
Assignee: SONY GROUP CORPORATION (Tokyo)
Inventor: Tetsu Sumii (Kanagawa)
Primary Examiner: Michelle E. Wilson
Assistant Examiner: David Michael Sullivan
Application Number: 29/992,053
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)