Headset

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Description

FIG. 1 is a front, bottom, right perspective view of a headset showing the new design;

FIG. 2 is a rear, bottom, right perspective view of the headset shown in FIG. 1;

FIG. 3 is a front elevational view of the headset shown in FIG. 1;

FIG. 4 is a rear elevational view of the headset shown in FIG. 1;

FIG. 5 is a left-side elevational view of the headset shown in FIG. 1;

FIG. 6 is a right-side elevational view of the headset shown in FIG. 1;

FIG. 7 is a top plan view of the headset shown in FIG. 1; and,

FIG. 8 is a bottom plan view of the headset shown in FIG. 1.

The broken lines shown in the drawings are for the purpose of illustrating portions of the headset that form no part of the claimed design.

Claims

The ornamental design for a headset, as shown and described.

Referenced Cited
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Other references
  • Maeline, “Bulk Wired Cord . . . ”, available at walmart.com, oldest review date Sep. 7, 2024, site visited Feb. 3, 2026, available at URL: https://shorturl.at/CHIvB (Year: 2024).
  • Sungdogin, “2025 New Bluetooth . . . ”, available at amazon.com, date first available May 5, 2025, site visited Feb. 3, 2026, available at URL: https://a.co/d/0cRCcxSw (Year: 2025).
  • Rtusia, “Small Bluetooth Headphones . . . ”, available at amazon.com, date first available Jul. 30, 2023, site visited Feb. 3, 2026, available at URL: https://a.co/d/0aPFnE4y (Year: 2023).
Patent History
Patent number: D1132906
Type: Grant
Filed: Apr 28, 2025
Date of Patent: Jul 7, 2026
Assignee: SHENZHEN GRANDSUN ELECTRONIC CO., LTD. (Shenzhen)
Inventors: Jiugao Peng (Shenzhen), Haiquan Wu (Shenzhen), Zhihui Wu (Shenzhen), Ruiwen Shi (Shenzhen), Zhijun Zhang (Shenzhen)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 30/001,307
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)