Cover for earphone case or the like

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Description

FIG. 1 is a perspective view of a cover for earphone case or the like showing my new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the drawings are for the purpose of illustrating portions of the cover for earphone case or the like that form no part of the claimed design.

Claims

The ornamental design for a cover for earphone case or the like as shown and described.

Referenced Cited
U.S. Patent Documents
D882259 April 28, 2020 Liu
D891434 July 28, 2020 Lee
D893184 August 18, 2020 Liu
D893185 August 18, 2020 Liu
D902588 November 24, 2020 Zhang
D904005 December 8, 2020 Jung
D907049 January 5, 2021 Yu
D927417 August 10, 2021 Sretovic
D934565 November 2, 2021 Wright
D942387 February 1, 2022 Chen
D951258 May 10, 2022 Lorsold
D953739 June 7, 2022 Akana
D958527 July 26, 2022 Chung
D976585 January 31, 2023 Akana
D996821 August 29, 2023 Li
D997553 September 5, 2023 Kim
D1019132 March 26, 2024 Wang
D1024935 April 30, 2024 Lee
D1043118 September 24, 2024 Lee
D1070820 April 15, 2025 Akana
D1093895 September 23, 2025 Zhong
Other references
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Patent History
Patent number: D1138141
Type: Grant
Filed: Sep 2, 2022
Date of Patent: Aug 4, 2026
Assignee: SHENZHEN LOPIE SOPHISTICATED INDUSTRY CO., LTD (Shenzhen)
Inventor: Jianjun Wang (Shenzhen)
Primary Examiner: Kevin K Rudzinski
Assistant Examiner: Darcy Fabre
Application Number: 29/852,002
Classifications
Current U.S. Class: D3/218; D3/294