Mount for electronic devices
Description
The broken lines shown in the drawings depict portions of the mount for electronic devices that form no part of the claimed design.
Claims
The ornamental design for a mount for electronic devices, as shown and described.
Referenced Cited
U.S. Patent Documents
| D635555 | April 5, 2011 | Giles |
| D847789 | May 7, 2019 | Virhia |
| D908112 | January 19, 2021 | Eshelman |
| D908113 | January 19, 2021 | Eshelman |
| D954025 | June 7, 2022 | Li |
| D983170 | April 11, 2023 | Lin |
| D1026928 | May 14, 2024 | Wengreen |
| D1028691 | May 28, 2024 | Nazarian |
| D1034621 | July 9, 2024 | Wengreen |
| D1037202 | July 30, 2024 | Pickrell, III |
| D1043617 | September 24, 2024 | Hayes |
| D1065138 | March 4, 2025 | Koby |
Patent History
Patent number: D1144277
Type: Grant
Filed: Jun 13, 2025
Date of Patent: Aug 25, 2026
Assignee: Shenzhen EDUP Electronics Technology Co., Ltd (Shenzhen)
Inventors: Chunping Zhou (Shenzhen), Cheng Wang (Shenzhen)
Primary Examiner: Khawaja Anwar
Application Number: 30/008,305
Type: Grant
Filed: Jun 13, 2025
Date of Patent: Aug 25, 2026
Assignee: Shenzhen EDUP Electronics Technology Co., Ltd (Shenzhen)
Inventors: Chunping Zhou (Shenzhen), Cheng Wang (Shenzhen)
Primary Examiner: Khawaja Anwar
Application Number: 30/008,305
Classifications
Current U.S. Class:
Element Or Attachment (11) (D14/217)