Patents by Inventor Cheng Wang

Cheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220256633
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably transmit a first device information corresponding to the first member device and a second device information corresponding to the second member device to the Bluetooth host device. The Bluetooth host device is arranged to operably receive the first device information and the second device information transmitted from the first member device. The Bluetooth host device is further arranged to operably establish a Bluetooth connection with the first member device and conduct pairing procedure with the first member device after receiving a selection command.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 11, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Qing GU, Bi WEI, Yu Hsuan LIU, Yung Chieh LIN, Cheng CAI, Sixian WANG
  • Publication number: 20220256627
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably transmit an auto-pair request, a first device information corresponding to the first member device, and a second device information corresponding to the second member device to the Bluetooth host device. The Bluetooth host device is arranged to operably receive the auto-pair request, the first device information, and the second device information transmitted from the first member device. The Bluetooth host device is further arranged to operably establish a Bluetooth connection with the first member device and conduct pairing procedure with the first member device according to the auto-pair request.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 11, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Qing GU, Bi WEI, Yu Hsuan LIU, Yung Chieh LIN, Cheng CAI, Sixian WANG
  • Publication number: 20220255232
    Abstract: An antenna structure and a mobile device including the same are provided. The mobile includes a metal back cover and an antenna structure. The metal back cover has an open slot. The antenna structure includes a feeding metal radiator, a first grounded metal radiator, a second grounded metal radiator, and a substrate. The feeding metal radiator includes a first radiating portion, a first connecting portion, a second radiating portion and a feeding portion. The first radiating portion extends along a second direction from one side of the opening slot. The second radiating portion is coupled with the first radiating portion through the first connecting portion. The feeding portion is connected to the second radiating portion and extends along the second direction from one side of the open slot.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 11, 2022
    Inventors: CHIH-FENG TAI, KUAN-HSUN LAI, KUEI-CHENG WANG
  • Publication number: 20220254882
    Abstract: A semiconductor structure includes a first stack of active channel layers and a second stack of active channel layers disposed over a semiconductor substrate, where the second stacking include a dummy channel layer and the first stack is free of any dummy channel layer, a gate structure engaged with the first stack and the second stack, and first S/D features disposed adjacent to the first stack and second S/D features disposed adjacent to the second stack, where the second S/D features overlap with the dummy channel layer.
    Type: Application
    Filed: November 5, 2021
    Publication date: August 11, 2022
    Inventors: Kuo-Cheng Chiang, Shi Ning Ju, Guan-Lin Chen, Jung-Chien Cheng, Chih-Hao Wang, Kuan-Lun Cheng
  • Publication number: 20220251203
    Abstract: The present disclosure provides the use of an anti-PD-1 antibody in combination with famitinib in the preparation of a drug for treating tumors. In the present technical solution, toxicity is controllable and tolerable. At the same time, the described drug combination effectively reduces adverse reactions to the anti-PD-1 antibody, such as the occurrence of reactive capillary endothelial proliferation.
    Type: Application
    Filed: November 5, 2019
    Publication date: August 11, 2022
    Inventors: Lianshan Zhang, Qing Yang, Quanren Wang, Xiaoxing Huang, Cheng Liao, Changyong Yang, Dingwei Ye, Xiaohua Wu
  • Publication number: 20220255901
    Abstract: Devices, systems, methods, and non-transitory computer-readable media for modular network architecture. In one embodiment, a server includes a memory and an electronic processor. The memory stores cloud infrastructure definitions, the cloud infrastructure definitions including a plurality of microservices and security groups that define communication between each of the plurality of microservices. The electronic processor is configured to deploy a first virtual private cloud including a first portion of the plurality of microservices and all of the security groups, deploy a second virtual private cloud including a second portion of the plurality of microservices and the all of the security groups, and deploy a third virtual private cloud including a third portion of the plurality of microservices and the all of the security groups.
    Type: Application
    Filed: February 8, 2022
    Publication date: August 11, 2022
    Inventors: Ian Cheng, Carlos Eduardo Martell Ayala, I-Cheng Wang, Christopher Zhu Tan, Jonathan Pelletier, Saad Zaamout
  • Patent number: 11406061
    Abstract: Disclosed is an automated walnut picking and collection method based on multi-sensor fusion technology, including: operation 1.1: when a guide vehicle for automated picking and collection is started, performing path planning for the guide vehicle; operation 1.2: remotely controlling the guide vehicle to move in a park according to a first predetermined rule, and collecting laser data of the entire park; operation 1.3: constructing a two-dimensional offline map; operation 1.4: marking a picking road point on the two-dimensional offline map; operation 2.1: performing system initialization; operation 2.2: obtaining a queue to be collected; operation 2.3: determining and sending, by the automated picking system, a picking task; operation 2.4: arriving, by the picking robot, at picking target points in sequence; operation 2.5: completing a walnut shaking and falling operation; and operation 2.6: collecting shaken walnuts.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: August 9, 2022
    Assignees: ANHUI AGRICULTURAL UNIVERSITY, FUYANG XINFENG SEED CO., LTD.
    Inventors: Songling Fu, Zhaocheng Wang, Hua Liu, Haoxin Ge, Fan Yang, Xu Li, Yuhua Ma, Cheng Huang
  • Patent number: 11410972
    Abstract: A method for manufacturing three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is formed and bonded to a first IC die by a first bonding structure. A third IC die is formed and bonded to the second IC die by a second bonding structure. The second bonding structure is formed between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. In some further embodiments, the second bonding structure is formed by forming conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih-Han Huang, I-Nan Chen
  • Patent number: 11410901
    Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: August 9, 2022
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Lee-Cheng Shen, Ying-Po Hung, Chao-Chieh Chan, Chao-Hsuan Wang
  • Patent number: 11406187
    Abstract: A slide rail assembly includes a first rail including a blocking member and a positioning member, a second rail including a predetermined feature, a working member and an operation member. When the second rail is at a first extending position, the blocking member is in a blocking state capable of blocking the working member so as to prevent the second rail from displacing along a retracting direction. The operation member is capable of being operated to drive the blocking member to leave the blocking state so as to allow the second rail to displace along the retracting direction. When the second rail is displaced from the first extending position to a second extending position along the retracting direction, the second rail is engaged with the positioning member through the predetermined feature so as to prevent the second rail from leaving the second extending position.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: August 9, 2022
    Assignees: KING SLIDE WORKS CO., LTD., KING SLIDE TECHNOLOGY CO., LTD.
    Inventors: Ken-Ching Chen, Shun-Ho Yang, Tzu-Cheng Weng, Chun-Chiang Wang
  • Publication number: 20220243030
    Abstract: A white polyester film and a method for manufacturing the same are provided. The method for manufacturing the white polyester film includes: providing a recycled polyester material; physically regenerating a part of the recycled polyester material to form physically regenerated polyester chips having a first intrinsic viscosity; chemically regenerating another part of the recycled polyester material to form chemically regenerated polyester chips having a second intrinsic viscosity less than the first intrinsic viscosity; mixing white regenerated polyester chips, the physically regenerated polyester chips, and the chemically regenerated polyester chips according to a predetermined intrinsic viscosity so as to form a polyester masterbatch material; melting and extruding the polyester masterbatch material to obtain the white polyester film having the predetermined intrinsic viscosity.
    Type: Application
    Filed: August 13, 2021
    Publication date: August 4, 2022
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Wen-Cheng Yang, Te-Chao Liao, Chun-Cheng Yang, Chia-Yen Hsiao, Chih-Feng Wang
  • Publication number: 20220242847
    Abstract: The present disclosure is directed to pyridinone derivatives of Formula I and their use for selectively killing HIV infected GAG-POL expressing cells without concomitant cytotoxicity to HIV nave cells, and for the treatment of infection by HIV, or for the treatment, prophylaxis or delay in the onset or progression of AIDS or AIDS Related Complex (ARC).
    Type: Application
    Filed: May 18, 2020
    Publication date: August 4, 2022
    Applicant: Merck Sharp & Dohme Corp.
    Inventors: Antonella Converso, Abdellatif El Marrouni, Ashley Forster, Jessica L. Frie, David N. Hunter, Cheng Wang, Deping Wang
  • Publication number: 20220246614
    Abstract: According to one example, a semiconductor device includes a substrate and a fin stack that includes a plurality of nanostructures, a gate device surrounding each of the nanostructures, and inner spacers along the gate device and between the nanostructures. A width of the inner spacers differs between different layers of the fin stack.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 4, 2022
    Inventors: Jui-Chien Huang, Shih-Cheng Chen, Chih-Hao Wang, Kuo-Cheng Chiang, Zhi-Chang Lin, Jung-Hung Chang, Lo-Heng Chang, Shi Ning Ju, Guan-Lin Chen
  • Publication number: 20220246549
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor device, the method including forming a plurality of photodetectors in a substrate. A device isolation structure is formed within the substrate. The device isolation structure laterally wraps around the plurality of photodetectors. An outer isolation structure is formed within the substrate. The device isolation structure is spaced between sidewalls of the outer isolation structure. The device isolation structure and the outer isolation structure comprise a dielectric material.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Tung-Ting Wu, Chen-Jong Wang, Jen-Cheng Liu, Yimin Huang, Chin-Chia Kuo
  • Publication number: 20220245213
    Abstract: This application provides a content recommendation method and apparatus, an electronic device, and a storage medium.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Cheng LING, Yalong WANG, Rui WANG, Ruobing XIE, Feng XIA, Leyu LIN
  • Publication number: 20220248212
    Abstract: Embodiments of the present disclosure provide methods, apparatus and computer program products for network function service discovery. A method implemented at a second network node in a wireless core network with service based architecture comprises: receiving a registration request for network function instance from a network function, the registration request comprising information identifying a subscriber group to which the network function instance is applicable; and storing the information in association with the network function instance. With embodiments of the disclosure, size of NF profile can be saved.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Inventors: Cheng Wang, Yong Yang, Gang Ren, Xiao Li, Xinyu Zhang, Junyi Wang
  • Publication number: 20220246083
    Abstract: Provided in the present invention are a video wall control device and method. The video wall control device comprises: a processor, a memory, a video wall, and a control interface, wherein the memory is used for storing configuration information of multiple video devices; and the processor comprises a detection module for detecting whether the video wall control device receives a connection request from a video device; an acquisition module for acquiring, when the video wall control device receives a connection request from a video device, the configuration information of the video device; a determination module for determining the type of video device according to the acquired configuration information; a loading module for loading a video control service corresponding to the type of video device; and a control module for controlling, in response to the connection request and according to the loaded video control service, the content to be projected of the video device to he projected on a video wall.
    Type: Application
    Filed: May 15, 2020
    Publication date: August 4, 2022
    Inventors: WEI-TSUNG HUNG, YI ZHOU, ZHEN-HUI LIAO, JIAN-PING YU, YONG-CHENG TANG, DONG-FENG WANG
  • Publication number: 20220246791
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Kai CHENG, Tsau-Hua HSIEH, Fang-Ying LIN, Tung-Kai LIU, Hui-Chieh WANG, Chun-Hsien LIN, Jui-Feng KO
  • Publication number: 20220246790
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Kai CHENG, Tsau-Hua HSIEH, Fang-Ying LIN, Tung-Kai LIU, Hui-Chieh WANG, Chun-Hsien LIN, Jui-Feng KO
  • Patent number: 11404582
    Abstract: The embodiments of the present disclosure provide an array substrate and a method for manufacturing the same, and a display device. The array substrate includes a substrate, wherein the substrate has a display region and a peripheral region surrounding the display region, the display region has a plurality of pixels arranged in an array, and each of the plurality of pixels includes a light transmission region and a light shielding region, and a light shielding block covering at least a part of the light transmission region of at least one pixel close to the peripheral region of the plurality of pixels.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 2, 2022
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yanqing Chen, Jianyun Xie, Wei Li, Cheng Li, Pan Guo, Yanfeng Li, Weida Qin, Ning Wang