Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a left side view thereof; and,

FIG. 8 is an enlarged view showing a portion 8 of FIG. 1.

The broken lines shown in the drawings illustrate portions of the headphone that form no part of the claimed design. The dash dash broken lines encircling portions of the headphone in FIG. 1 and illustrated in the enlarged view of FIG. 8 form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

Referenced Cited
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Patent History
Patent number: D1146869
Type: Grant
Filed: Jul 26, 2024
Date of Patent: Sep 8, 2026
Assignee: HIFIMAN KUNSHAN TECHNOLOGY GROUP CO., LTD (Kunshan)
Inventor: Fang Bian (Kunshan)
Primary Examiner: Paula Allen Greene
Application Number: 29/954,556
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)