Headphone combined with microphone
Latest Sony Corporation Patents:
- INTERFACE CIRCUIT AND INFORMATION PROCESSING SYSTEM
- Information processing apparatus and information processing method
- Transmission device, transmission method, and program
- Method for manufacturing semiconductor device with recess, epitaxial growth and diffusion
- CONFLICT RESOLUTION BETWEEN BEACON TRANSMISSION AND R-TWT SP
FIG. 1 is a perspective view of a first embodiment of the headphone combined with a microphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of FIG. 1;
FIG. 9 is a top plan view thereof shown in FIG. 8;
FIG. 10 is a front elevational view thereof shown in FIG. 8;
FIG. 11 is a rear elevational view thereof shown in FIG. 8;
FIG. 12 is a bottom plan view thereof shown in FIG. 8;
FIG. 13 is a left side elevational view thereof shown in FIG. 8; and,
FIG. 14 is a right side elevational view thereof shown in FIG. 8.
Type: Grant
Filed: Sep 13, 1995
Date of Patent: Dec 17, 1996
Assignee: Sony Corporation (Tokyo)
Inventor: Haruo Hayashi (Tokyo)
Primary Examiner: Sandra L. Morris
Assistant Examiner: Nanda Bondade
Law Firm: Foley & Lardner
Application Number: 0/43,819