Headphone combined with microphone

- Sony Corporation
Description

FIG. 1 is a perspective view of a first embodiment of the headphone combined with a microphone showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a perspective view of a second embodiment of FIG. 1;

FIG. 9 is a top plan view thereof shown in FIG. 8;

FIG. 10 is a front elevational view thereof shown in FIG. 8;

FIG. 11 is a rear elevational view thereof shown in FIG. 8;

FIG. 12 is a bottom plan view thereof shown in FIG. 8;

FIG. 13 is a left side elevational view thereof shown in FIG. 8; and,

FIG. 14 is a right side elevational view thereof shown in FIG. 8.

Referenced Cited
U.S. Patent Documents
D254183 February 12, 1980 Doodson
D353818 December 27, 1994 Nakamura
3087028 April 1963 Bonnin
Foreign Patent Documents
4019529 January 1991 DEX
Other references
  • Hong Kong Enterprise Jun. 1991, p. 130, Headphone model No. SW 1100.
Patent History
Patent number: D376598
Type: Grant
Filed: Sep 13, 1995
Date of Patent: Dec 17, 1996
Assignee: Sony Corporation (Tokyo)
Inventor: Haruo Hayashi (Tokyo)
Primary Examiner: Sandra L. Morris
Assistant Examiner: Nanda Bondade
Law Firm: Foley & Lardner
Application Number: 0/43,819
Classifications