Mobile phone
Description
The broken lines in drawings show portions of the mobile phone that form no part of the claimed design.
Claims
The ornamental design for a mobile phone, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| D963601 | September 13, 2022 | Ma |
| D967049 | October 18, 2022 | Shin |
| D973620 | December 27, 2022 | Yu |
| D981981 | March 28, 2023 | Zhou |
| D1004560 | November 14, 2023 | Li |
| D1010630 | January 9, 2024 | Xu |
| D1013652 | February 6, 2024 | Xu |
| D1013654 | February 6, 2024 | Xu |
| D1015319 | February 20, 2024 | Xu |
| D1016027 | February 27, 2024 | Xu |
| D1062677 | February 18, 2025 | Cai |
| D1079663 | June 17, 2025 | Tian |
| D1090475 | August 26, 2025 | Wang |
| 8371546 | September 2021 | EM |
- GSMArena.com, Honor 70 Pro pictures, official photos, first available Jun. 13, 2022 [online], retrieved Nov. 4, 2025, available at URL: https://www.gsmarena.com/honor_70_pro-pictures-11576.php (Year: 2022).
Patent History
Patent number: D1156349
Type: Grant
Filed: Jul 20, 2022
Date of Patent: Nov 3, 2026
Assignee: Honor Device Co., Ltd. (Shenzhen)
Inventors: Meng Li (Shenzhen), Liang Pan (Shenzhen), Zhaozhao Liu (Shenzhen), Yaodong Tan (Shenzhen), Hyun Woo Kim (Shenzhen), Zhiwei Wang (Shenzhen)
Primary Examiner: Michael A. Pratt
Assistant Examiner: Carrie S Gelula
Application Number: 29/846,900
Type: Grant
Filed: Jul 20, 2022
Date of Patent: Nov 3, 2026
Assignee: Honor Device Co., Ltd. (Shenzhen)
Inventors: Meng Li (Shenzhen), Liang Pan (Shenzhen), Zhaozhao Liu (Shenzhen), Yaodong Tan (Shenzhen), Hyun Woo Kim (Shenzhen), Zhiwei Wang (Shenzhen)
Primary Examiner: Michael A. Pratt
Assistant Examiner: Carrie S Gelula
Application Number: 29/846,900
Classifications
Current U.S. Class:
Handset (23) (D14/248)