Material machining device enclosure
FIG. 1 is a perspective view showing a first preferred embodiment of my design for a material machining device enclosure;
FIG. 2 is a front elevation view of the embodiment of FIG. 1;
FIG. 3 is an end elevation view of the embodiment of FIG. 1, it being understood that the end opposite that shown is the same;
FIG. 4 is a top plan view of the embodiment of FIG. 1;
FIG. 5 is a bottom plan view of the embodiment of FIG. 1;
FIG. 6 is a rear elevation view of the embodiment of FIG. 1;
FIG. 7 is a front elevation view of a second preferred embodiment of my design for a material machining device enclosure, it being understood that all other views of such design are the same as the corresponding views of my first preferred embodiment shown in FIGS. 1-6;
FIG. 8 is a front elevation view of a third preferred embodiment of my design for a material machining device enclosure;
FIG. 9 is a top plan view of the third preferred embodiment of my design;
FIG. 10 is a rear elevation view of the third preferred embodiment of my design; and
FIG. 11 is a bottom plan view of the third preferred embodiment of my design, it being understood that both end elevation views of such embodiment are the same as the end elevation view depicted in FIG. 3 for the first preferred embodiment of my design.
Type: Grant
Filed: Aug 20, 1979
Date of Patent: Oct 12, 1982
Assignee: HDE Systems, Inc. (Sunnyvale, CA)
Inventor: Simon L. Engel (Sunnyvale, CA)
Primary Examiner: Peter M. Caun
Attorney: C. Michael Zimmerman
Application Number: 6/67,877
International Classification: D1509;