Heat sink or similar article
Latest Thermalloy Incorporated Patents:
- Heat sink for direct attachment to surface mount electronic device packages
- Heat dissipation system having releasable attachment assembly
- Heat sink mounting assembly for surface mount electronic device packages
- Apparatus for securing electronic device packages to heat sinks
- Spring clip fastener for surface mounting of printed circuit board components
Description
FIG. 1 is a top plan view of a heat sink or similar article showing my new design;
FIG. 2 is a side elevational view thereof; and
FIG. 3 is a bottom plan view of the heat sink or similar article of my invention.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
2838740 | June 1958 | Larky et al. |
2879977 | March 1959 | Trought |
3033537 | May 1962 | Brown, Jr. |
1071431 | June 1967 | GBX |
Patent History
Patent number: D268666
Type: Grant
Filed: May 18, 1981
Date of Patent: Apr 19, 1983
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventor: Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz & Timmons
Application Number: 6/264,935
Type: Grant
Filed: May 18, 1981
Date of Patent: Apr 19, 1983
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventor: Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz & Timmons
Application Number: 6/264,935
Classifications
Current U.S. Class:
D13/23
International Classification: D1303;
International Classification: D1303;