Dual heat sink for electronic semiconductor devices

- Aavid Engineering, Inc.
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Description

FIG. 1 is a perspective view of a dual heat sink for electronic semiconductor devices showing my new design; the broken lines being shown for illustrative purposes, only;

FIG. 2 is a front elevational view of the same heat sink;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;

FIG. 5 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
3407868 October 1968 Coe
3893161 July 1975 Pesak, Jr.
4054901 October 18, 1977 Edwards et al.
Other references
  • Amperex Transistor Brocure, 6/1966, Extruded Aluminum Heat-Sink.
Patent History
Patent number: D269084
Type: Grant
Filed: Apr 8, 1981
Date of Patent: May 24, 1983
Assignee: Aavid Engineering, Inc. (Laconia, NH)
Inventor: Alfred F. McCarthy (Belmount, NH)
Primary Examiner: Susan J. Lucas
Attorney: James E. Mrose
Application Number: 6/252,030
Classifications
Current U.S. Class: D13/23
International Classification: D1303;