Twin heat sink for electronic semiconductor devices

- Aavid Engineering, Inc.
Skip to: Description  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a twin heat sink for electronic semiconductor devices showing my new design; the broken lines being shown for illustrative purposes, only;

FIG. 2 is a front elevational view of the same heat sink;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;

FIG. 5 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
3407868 October 1968 Coe
3893161 July 1975 Pesak, Jr.
4012769 March 15, 1977 Edwards et al.
4054901 October 18, 1977 Edwards et al.
Other references
  • Amperex Transistor brochure, 6/66, Extruded Aluminum Heat-Sink.
Patent History
Patent number: D273006
Type: Grant
Filed: Apr 8, 1981
Date of Patent: Mar 13, 1984
Assignee: Aavid Engineering, Inc. (Laconia, NH)
Inventor: Alfred F. McCarthy (Belmount, NH)
Primary Examiner: Susan J. Lucas
Attorney: James E. Mrose
Application Number: 6/252,029
Classifications
Current U.S. Class: D13/23