Heat sink or similar article
Latest Thermalloy Incorporated Patents:
- Heat sink for direct attachment to surface mount electronic device packages
- Heat dissipation system having releasable attachment assembly
- Heat sink mounting assembly for surface mount electronic device packages
- Apparatus for securing electronic device packages to heat sinks
- Spring clip fastener for surface mounting of printed circuit board components
Description
FIG. 1 is a perspective view of a heat sink or similar article showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a side elevational view thereof, the opposite side being a mirror image of that shown in FIG. 4; and
FIG. 5 is an end elevational view of the end thereof opposite that shown in FIG. 1.
Referenced Cited
U.S. Patent Documents
269606 | July 1983 | Jordan et al. |
3009510 | November 1961 | Meshulam |
3025489 | March 1962 | August |
3187082 | June 1965 | Allison |
3893161 | July 1975 | Pesak, Jr. |
Patent History
Patent number: D280811
Type: Grant
Filed: Apr 15, 1983
Date of Patent: Oct 1, 1985
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventor: Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Richards, Harris, Medlock & Andrews
Application Number: 6/485,204
Type: Grant
Filed: Apr 15, 1983
Date of Patent: Oct 1, 1985
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventor: Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Richards, Harris, Medlock & Andrews
Application Number: 6/485,204
Classifications
Current U.S. Class:
D13/23