Heat sink for integrated-circuit chip carrier
Latest Aavid Engineering, Inc. Patents:
- Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components
- Spring clamp assembly for improving thermal contact between stacked electronic components
- Thermal management system having a thermally conductive sheet and a liquid transporting material
- Heat sink assemblies
- Self-locking tab
Description
FIG. 1 is a perspective view of a heat sink for integrated-circuit chip carrier showing my new design, the broken lines being shown for illustrative purposes only;
FIG. 2 is a perspective view thereof, omitting the broken lines for clarity of disclosure;
FIG. 3 is a side elevational view thereof, looking upwardly toward the right in relation to the heat sink as it is shown in FIG. 1;
FIG. 4 is a side elevational view thereof, looking upwardly toward the left in relation to the heat sink as it is shown in FIG. 1;
FIG. 5 is a top plan view thereof; and
FIG. 6 is a bottom plan view thereof.
Referenced Cited
U.S. Patent Documents
D262960 | February 9, 1982 | Johnson et al. |
3187812 | June 1965 | Staver |
Patent History
Patent number: D285194
Type: Grant
Filed: Oct 24, 1984
Date of Patent: Aug 19, 1986
Assignee: Aavid Engineering, Inc. (Laconia, NH)
Inventor: Alfred F. McCarthy (Belmount, NH)
Primary Examiner: Susan J. Lucas
Attorney: James E. Mrose
Application Number: 6/664,258
Type: Grant
Filed: Oct 24, 1984
Date of Patent: Aug 19, 1986
Assignee: Aavid Engineering, Inc. (Laconia, NH)
Inventor: Alfred F. McCarthy (Belmount, NH)
Primary Examiner: Susan J. Lucas
Attorney: James E. Mrose
Application Number: 6/664,258
Classifications
Current U.S. Class:
D13/23