Semiconductor housing
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FIG. 1 is a right side, top and front perspective view of a semiconductor housing showing my new design;
FIG. 2 is a top plan view thereof on a reduced scale;
FIG. 3 is a bottom plan view thereof on a reduced scale;
FIG. 4 is a left side elevational view thereof on a reduced scale;
FIG. 5 is a right side elevational view thereof on a reduced scale;
FIG. 6 is a front elevational view thereof on a reduced scale;
FIG. 7 is a rear elevational view thereof on a reduced scale;
FIG. 8 is a top plan view of second embodiment of my new design, the second embodiment being identical to the first except for the number of leads on the right hand side;
FIG. 9 is a bottom plan view thereof;
FIG. 10 is a top plan view of a third embodiment of my new design, the third design being identical to the first embodiment except for the shape of the two leads on the left hand side;
FIG. 11 is a bottom plan view thereof;
FIG. 12 is a right side, top and front perspective view of a fourth embodiment of my new design;
FIG. 13 is a top plan view thereof on a reduced scale;
FIG. 14 is a front elevational view thereof on a reduced scale;
FIG. 15 is a left side elevational view thereof on a reduced scale;
FIG. 16 is a right side, top and front perspective view of a fifth embodiment of my new design, the fifth embodiment being identical to the first embodiment except for the flat top surface;
FIG. 17 is a right side, top and front perspective view of a sixth embodiment of my new design;
FIG. 18 is a top plan view thereof on a reduced scale;
FIG. 19 is a bottom plan view thereof on a reduced scale;
FIG. 20 is a left side elevational view thereof on a reduced scale;
FIG. 21 is a right side elevational view thereof on a reduced scale.
3340347 | September 1967 | Spiegler |
3902148 | August 1975 | Drees et al. |
3918084 | November 1975 | Schierz |
3946428 | March 23, 1976 | Anazawa et al. |
4047197 | September 6, 1977 | Schierz |
4067040 | January 3, 1978 | Tsuzuki et al. |
4079410 | March 14, 1978 | Schierz |
4106052 | August 8, 1978 | Schierz |
4213141 | July 15, 1980 | Colussi |
4218724 | August 19, 1980 | Kaufman |
4278990 | July 14, 1981 | Fichot |
4278991 | July 14, 1981 | Ritchie et al. |
4340900 | July 20, 1982 | Goronkin |
2607083 | September 1977 | DEX |
- IBM Technical Disclosure Bulletin, vol. 21, #1, 6-1978, pp. 99-100, Circuit Chip Support Assembly, Coombs & Larnerd.
Type: Grant
Filed: Sep 10, 1984
Date of Patent: Mar 3, 1987
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventor: Jerry M. Du Bois (Mesa, AZ)
Primary Examiner: Susan J. Lucas
Attorney: Robert Handy
Application Number: 6/649,081