Housing for a printed circuit board
- AT&T
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Description
FIG. 1 is a front, top and left side perspective view of a housing for a printed circuit board showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof; and
FIG. 6 is a right side elevational view thereof.
Referenced Cited
Patent History
Patent number: D294579
Type: Grant
Filed: Dec 23, 1985
Date of Patent: Mar 8, 1988
Assignee: AT&T Teletype Corporation (Skokie, IL)
Inventors: Kenneth R. Kirpluk (Elmwood Park, IL), Joseph G. Murglin (Norridge, IL), John W. Petras (Mt. Prospect, IL)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Ruth Takemoto
Attorney: A. A. Tirva
Application Number: 6/811,980
Type: Grant
Filed: Dec 23, 1985
Date of Patent: Mar 8, 1988
Assignee: AT&T Teletype Corporation (Skokie, IL)
Inventors: Kenneth R. Kirpluk (Elmwood Park, IL), Joseph G. Murglin (Norridge, IL), John W. Petras (Mt. Prospect, IL)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Ruth Takemoto
Attorney: A. A. Tirva
Application Number: 6/811,980
Classifications
Current U.S. Class:
D14/114;
D13/41
