Housing for a printed circuit board

- AT&T

FIG. 1 is a front, top and left side perspective view of a housing for a printed circuit board showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevational view thereof; and

FIG. 6 is a right side elevational view thereof.

Referenced Cited
U.S. Patent Documents
D272340 January 24, 1984 Korzik
D277189 January 15, 1985 Shibata
4386388 May 31, 1983 Beun
Patent History
Patent number: D294579
Type: Grant
Filed: Dec 23, 1985
Date of Patent: Mar 8, 1988
Assignee: AT&T Teletype Corporation (Skokie, IL)
Inventors: Kenneth R. Kirpluk (Elmwood Park, IL), Joseph G. Murglin (Norridge, IL), John W. Petras (Mt. Prospect, IL)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Ruth Takemoto
Attorney: A. A. Tirva
Application Number: 6/811,980
Current U.S. Class: D14/114; D13/41