Lead frame for a semiconductor element or the like
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Description
FIG. 1 is a top plan view of a lead frame for a semiconductor element or the like showing our new design, the bottom being a mirror image thereof;
FIG. 2 is a right side elevational view thereof, the opposite side being a mirror image thereof; and
FIG. 3 is a front elevational view thereof, the rear being a mirror image thereof.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
D236127 | July 1975 | Ernsthausen |
D238786 | February 1976 | Nixen et al. |
3676748 | July 1972 | Kobayashi et al. |
3951495 | April 20, 1976 | Donaher et al. |
4289922 | September 15, 1981 | Devlin |
2071425 | September 1981 | GBX |
- Conference: Eleventh Annual Connector Symposium Proceedings, Cherry Hill, N.J., 10/25/78, FIG. 1 on p. 2.
Patent History
Patent number: D298231
Type: Grant
Filed: Apr 24, 1985
Date of Patent: Oct 25, 1988
Assignee: Sumitomo Electric Industries, Ltd. (Osaka)
Inventors: Kazunao Kudoh (Hyogo), Hitoshi Akazawa (Hyogo)
Primary Examiner: Susan J. Lucas
Assistant Examiner: C. E. Heflin
Law Firm: Sughrue, Mion, Zinn, Macpeak, and Seas
Application Number: 6/726,737
Type: Grant
Filed: Apr 24, 1985
Date of Patent: Oct 25, 1988
Assignee: Sumitomo Electric Industries, Ltd. (Osaka)
Inventors: Kazunao Kudoh (Hyogo), Hitoshi Akazawa (Hyogo)
Primary Examiner: Susan J. Lucas
Assistant Examiner: C. E. Heflin
Law Firm: Sughrue, Mion, Zinn, Macpeak, and Seas
Application Number: 6/726,737
Classifications
Current U.S. Class:
D13/99;
D13/24