Abstract: The side surface has a first outer end surface. The bottom surface has a first bottom portion continuous to the first outer end surface, and a second bottom portion continuous to the first bottom portion and located on a side opposite to the inner end surface with respect to the first bottom portion. A silicon carbide substrate has a first region and a second region located between the at least one gate trench and a second main surface, and spaced from each other with a drift region being sandwiched therebetween. In a direction parallel to the first outer end surface, a spacing between the first region and the second region located between the first bottom portion and the second main surface is smaller than a spacing between the first region and the second region located between the second bottom portion and the second main surface.
Abstract: A control apparatus configured to control updating of a control program of an on-vehicle control device configured to control a target device installed in a vehicle, the control apparatus including: a prediction unit configured to predict, on the basis of signal information, a stopping time period of the vehicle caused by waiting for a traffic signal; an acquisition unit configured to acquire an updating time period, the updating time period being a time period required in updating of the control program; and a determination unit configured to determine whether or not updating of the control program during the waiting for the traffic signal is possible, on the basis of a result of comparison between the stopping time period and the updating time period.
Abstract: An optical fiber cable includes optical fiber ribbons of no less than 12, a slot rod including slot grooves in which the optical fiber ribbons are housed, a tension member, and a cable sheath. The optical fiber ribbons include, at a part of or through all of the optical fiber core wires, in a state where the optical fiber core wires are arranged in parallel, a connecting part where adjacent optical fiber core wires are connected and a non-connecting part where adjacent optical fiber core wires are not connected, which are provided intermittently in a longitudinal direction. A relationship between the number “x” of the optical fiber core wires housed in the optical fiber cable and flexural rigidity “y” (N·mm2) of the optical fiber cable satisfies following Expression 1. y?3e0.
Abstract: A core electric wire for a multi-core cable according to an aspect of the present invention comprises a conductor obtained by twisting element wires, and an insulating layer covering the conductor, a principal component of the insulating layer being a copolymer of ethylene and an ?-olefin having a carbonyl group; the ?-olefin content in the copolymer being 14% to 46% by mass; and a mathematical product C*E being 0.01 to 0.9, wherein C is a linear expansion coefficient of the insulating layer at from 25° C. to ?35° C., and E is a modulus of elasticity thereof at ?35° C. Average area of the conductor in the transverse cross section is 1.0 to 3.0 mm2. Average diameter of the element wires in the conductor is 40 to 100 ?m, and number of the element wires is 196 to 2,450.
Abstract: An optical communication device according to an embodiment of the present invention includes: a heat sink integrally having a plurality of contact portions respectively corresponding to the plurality of the optical transceivers, and a heat transfer portion bound to a casing so as to be able to transfer heat to the casing; a plurality of cage members configured to respectively accommodate the plurality of the optical transceivers, and having openings so as to allow the optical transceivers to be partially exposed to the contact portion side, respectively; a holding unit configured to hold the plurality of the cage members inside the casing in a state where the openings correspond to the contact portions, respectively; and an elastic member configured to bring the plurality of the optical transceivers into thermal contact with the plurality of the contact portions, respectively, by pressing each of the plurality of the cage members toward the heat sink side.
Abstract: A method of fabricating a surface-emitting laser includes the steps of fabricating a substrate product including device sections, a pad electrode, and a conductor, each of the device sections including a surface-emitting laser having an electrode, the conductor connecting the pad electrode to the electrode across a boundary of the device sections; attaching a connection device to the substrate product, the connection device including a probe device having a probe and a probe support base having an opening; performing a burn-in test of the surface-emitting lasers by applying electric power to the pad electrode through the probe at a high temperature; and after the burn-in test, separating the substrate product into semiconductor chips. The burn-in test includes a step of monitoring light emitted by the surface-emitting laser through the opening during the burn-in test, and a step of selecting the surface-emitting lasers based on a monitoring result.
Abstract: An optical transceiver according to one example comprises: a housing having an inner surface therein; a first printed circuit board on which a CDR, which generates heat by consuming electric power, is mounted; a second printed circuit board arranged between the inner surface and the first printed circuit board; a protection member arranged to surround the periphery of the CDR in parallel with the inner surface; a thermal conductive gel in contact with each of the CDR, the protection member and the second printed circuit board; a heat dissipation sheet arranged between the second printed circuit board and the inner surface; and a heat dissipation sheet arranged between the first printed circuit board and the inner surface, wherein the protection member has an opening in contact with a part of the thermal conductive gel.
Abstract: A semiconductor light receiving device includes a supporting base having an n-type semiconductor region; and a photodiode structure disposed on the supporting base. The photodiode structure includes a barrier structure enabling an electron barrier, a light absorbing layer including III-V compound semiconductor, and a p-type semiconductor region. The III-V compound semiconductor of the light absorbing layer has a bandgap allowing the light absorbing layer to be sensitive to infrared light. The barrier structure includes a first spacer layer, a first barrier layer, and a second spacer layer, and the p-type semiconductor region, the light absorbing layer, the first spacer layer, the first barrier layer, the second spacer layer, and the n-type semiconductor region are sequentially arranged along a direction of a first axis.
Abstract: The present embodiment relates to an optical fiber line or the like configured by connecting a single-mode optical fiber with a cladding containing fluorine and a large Aeff optical fiber by TEC connection, and a connection state between such two types of optical fibers is set such that a connection loss expressed in dB of a fundamental mode is equal to or less than 55% of an ideal butt loss expressed in dB at a wavelength of 1550 nm.
Abstract: An optical connector according to an exemplary embodiment is an optical connector including a plurality of optical connector plugs collectively connected to each of a plurality of adapters arranged along a first direction and a second direction intersecting the first direction, along a connection direction intersecting both the first direction and the second direction, the optical connector includes: a plurality of holders configured to be arranged along the second direction while holding the plurality of optical connector plugs arranged in the first direction, and a handle configured to hold the plurality of holders arranged in the second direction.
March 6, 2019
September 12, 2019
SEI OPTIFRONTIER CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
Abstract: An optical fiber having an effective area that can be easily increased and bending loss characteristics that can be easily improved is provided. The optical fiber includes a glass fiber including a core and a cladding; a first resin coating layer that is in contact with the glass fiber and surrounds the glass fiber; and a second resin coating layer that surrounds the first resin coating layer and has a Young's modulus greater than a Young's modulus of the first resin coating layer. An effective area is greater than or equal to 110 ?m2 and less than or equal to 180 ?m2 at a wavelength of 1550 nm. A cable cut-off wavelength is less than or equal to 1530 nm. A uniformity of thickness of the first resin coating layer is greater than or equal to 60% and less than or equal to 80%.
Abstract: A voltage measuring apparatus that individually measures voltages of n-pieces (2?n) of power storage elements B(1) to B(n) connected in series includes: first to n-th voltage detecting units that respectively individually measure voltages of the power storage elements; a switching circuit that switches a connection state between the power storage elements and the first to n-th voltage detecting units; a SW control unit that drives the switching circuit; and an operation processing unit. The power storage elements are arranged in order so that potential becomes higher as n increases. The switching circuit includes a capacitor connected in parallel to the power storage element B(1). In the switching circuit, the negative terminals of the power storage elements are connected to a first terminal of the capacitor via respective corresponding first switches. The positive terminals of the power storage elements are connected to a second terminal of the capacitor via respective corresponding second switches.
Abstract: This power supply device includes: an AC path from an input end to an output end; a current sensor configured to detect a current flowing through the AC path; a conversion unit connected to the AC path and being capable of bidirectional power conversion; a storage battery connected to the AC path via the conversion unit; an AC switch provided between the input end and a point at which the conversion unit is connected to the AC path, the AC switch including parallel body of a relay contact and a semiconductor switch; and a control unit configured to control the conversion unit and the AC switch. When the control unit executes a current conduction mode for the first time, and when the current sensor detects an excessive current during the current conduction mode, the control unit closes only the relay contact while keeping the semiconductor switch opened.
Abstract: A semiconductor light emitting apparatus includes: a stem part having a stem base, a lead terminal, and a metal member having a closed shape, the stem base having an inner portion having a first face, a second face and an opening extending in a first direction from the first face to the second face, and an outer portion surrounding the inner portion, the inner and outer portions being arranged along a reference plane intersecting the first direction, the lead terminal being supported in the opening, and the metal member being disposed on the outer portion so as to surround the inner portion and having a first portion supported by a top face of the outer portion, and a second portion extending outward with reference to an edge of the outer portion; a semiconductor optical element disposed on the inner portion; and a cap disposed on the metal member.
Abstract: A composite sintered material includes: a plurality of diamond grains having an average grain size of less than or equal to 10 ?m; a plurality of cubic boron nitride grains having an average grain size of less than or equal to 2 ?m; and a remainder of a binder phase, wherein at least parts of adjacent diamond grains are bound to one another, the binder phase includes cobalt, in the composite sintered material, a content of the diamond grains is more than or equal to 30 volume % and less than or equal to 94 volume %, a content of the cubic boron nitride grains is more than or equal to 3 volume % and less than or equal to 40 volume %, and a content of the cobalt is more than or equal to 3 volume % and less than or equal to 30 volume %.
October 10, 2017
September 5, 2019
SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC HARDMETAL CORP.
Abstract: The present invention relates to a method of manufacturing an optical fiber preform for obtaining an optical fiber with low transmission loss. A core preform included in the optical fiber preform comprises three or more core portions, which are each produced by a rod-in-collapse method, and in which both their alkali metal element concentration and chlorine concentration are independently controlled. In two or more manufacturing steps of the manufacturing steps for each of the three or more core portions, an alkali metal element is added. As a result, the mean alkali metal element concentration in the whole core preform is controlled to 7 atomic ppm or more and 70 atomic ppm or less.
Abstract: A strand for a wiring harness includes a first element wire and a second element wire twisted around the first element wire and made of copper or a copper alloy. The first element wire includes a core portion made of stainless steel and a covering layer covering the core portion and made of copper or a copper alloy.
Abstract: An electrode for redox flow batteries, the electrode being formed of a carbon fiber aggregate including a plurality of carbon fibers. Each of the carbon fibers has a plurality of pleats formed in the surface thereof. The ratio of L1 to L2, that is, L1/L2, is more than 1, where L1 is the peripheral length of a cross section of the carbon fibers and L2 is the peripheral length of a virtual rectangle circumscribing the cross section of the carbon fibers.
March 2, 2018
September 5, 2019
Sumitomo Electric Industries, Ltd., Sumitomo Electric Industries, Ltd.
Abstract: The invention provides a production method for a glass particulate deposit M which includes a deposition step where a starting rod 111 and a burner 222 for production of glass particles 130 are installed in a reactor 102, a glass source material is introduced into the burner 222, the glass source material is subjected to flame thermal decomposition in the flame formed by the burner 222 to thereby form glass particles 130, and the formed glass particles 130 are deposited on the starting rod 111 to produce a glass particulate deposit M. In the deposition step of the production method, at least two ejecting ports 231 are provided per one burner 222 for ejecting the glass source material from the burner 222, and a flow rate of the glass source material jetting out through one glass source material ejecting port 231 is from 4 m/s to 60 m/s.