Abstract: An optical fiber according to an embodiment has a structure for enabling determination of improvement in transmission loss at a preform stage. The optical fiber includes: a core containing Cl and having an average refractive index lower than a refractive index of pure silica glass; a first cladding containing F; a second cladding; and a resin coating, in which an effective area at a wavelength of 1550 nm is 135 ?m2 or more and 170 ?m2 or less, a ratio of the effective area to a cutoff wavelength ?C is 85.0 ?m or more, a bending loss of an LP01 mode at a wavelength of 1550 nm and at a bending radius of R15 mm is less than 4.9 dB per 10 turns, and the resin coating includes a primary resin layer having a Young's modulus of 0.3 MPa or less.
Abstract: A PON system according to one manner of the present invention includes an optical line terminal (OLT), at least one optical network unit (ONU), and an optical fiber that connects the optical line terminal and the optical network unit to each other. A reception level category for categorizing a reception level in the optical network unit, of an optical signal sent from the optical line terminal through the optical fiber is set. In discovery processing for searching for and registering an unregistered optical network unit, the optical line terminal registers an optical network unit corresponding to the reception level category.
Abstract: A carbon nanostructure producing method includes a growth step in which a plurality of catalyst particles in close contact with each other are separated in a flow of a carbon-containing gas so as to grow carbon nanotubes between the plurality of catalyst particles, and an elongation step in which the carbon nanotube is elongated by a wind pressure of the carbon-containing gas with at least one of the catalyst particles being retained.
June 29, 2018
September 17, 2020
SUMITOMO ELECTRIC INDUSTRIES, LTD., UNIVERSITY OF TSUKUBA
Abstract: Provided is a polyethylene resin for use in a spacer for an optical fiber cable, the polyethylene resin having a density of 0.952 g/cm3 or more, containing a polyethylene having a molecular weight of 10,000 or less in a weight fraction of 22% or more, and containing a polyethylene having a molecular weight of 300,000 or more in a weight fraction of 12% or more.
Abstract: A diamond polycrystal is a diamond polycrystal basically composed of a diamond single phase, wherein the diamond polycrystal is composed of a plurality of diamond grains having an average grain size of less than or equal to 30 nm, and the diamond polycrystal has a carbon dangling bond density of more than or equal to 10 ppm.
Abstract: An optical transceiver according to an embodiment includes a plurality of optical sub-assemblies, a circuit board, an optical receptacle, a WDM module, support member and a housing including the plurality of optical sub-assemblies, the circuit board, the optical receptacle, the WDM module, and the support member. The transmission sleeve and the reception sleeve have respective protrusions coupled to the plurality of first internal fibers in one to one. The housing has holes configured to allow the transmission sleeve and the reception sleeve for being inserted to the housing. The support member has a retaining part configured to retain the protrusions of the transmission sleeve and the reception sleeve for positioning the transmission sleeve and the reception sleeve.
Abstract: In a single-crystal diamond material, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond material has a crystal growth main surface having an off angle of not more than 20°. A perforated tool includes a single-crystal diamond die, wherein in the single-crystal diamond die, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond die has a low-index plane represented by a Miller index of not less than ?5 and not more than 5 in an integer, a perpendicular line of the low-index plane having an off angle of not more than 20° relative to an orientation of a hole for wire drawing.
March 20, 2019
Date of Patent:
September 15, 2020
Sumitomo Electric Industries, Ltd., Sumitomo Electric Hardmetal Corp.
Abstract: The side surface has a first outer end surface. The bottom surface has a first bottom portion continuous to the first outer end surface, and a second bottom portion continuous to the first bottom portion and located on a side opposite to the inner end surface with respect to the first bottom portion. A silicon carbide substrate has a first region and a second region located between the at least one gate trench and a second main surface, and spaced from each other with a drift region being sandwiched therebetween. In a direction parallel to the first outer end surface, a spacing between the first region and the second region located between the first bottom portion and the second main surface is smaller than a spacing between the first region and the second region located between the second bottom portion and the second main surface.
Abstract: An optical connector comprises a first optical waveguide including a plurality of cores each extending along a first direction, the first optical waveguide having a first end face, wherein the cores are arranged on the first end face at positions except a position of a central axis of the first optical waveguide, and a first lens having a second end face and a third end face in the first direction, the first lens having an optical axis extending along the first direction. The first optical waveguide and the first lens are arranged so that the central axis of the first optical waveguide coincides with the optical axis of the first lens. The second end face is positioned facing the first end face, and the third end face extends along a plane perpendicular to an optical axis of the first optical waveguide.
Abstract: The present embodiment relates to an optical fiber line or the like configured by connecting a single-mode optical fiber with a cladding containing fluorine and a large Aeff optical fiber by TEC connection, and a connection state between such two types of optical fibers is set such that a connection loss expressed in dB of a fundamental mode is equal to or less than 55% of an ideal butt loss expressed in dB at a wavelength of 1550 nm.
Abstract: A method and an apparatus for measuring a profile of a beam output from a randomly-coupled multi-core fiber are provided. An apparatus includes a light source, a measurement unit, and an analysis unit. Light output from the light source is input in one or more of a plurality of spatial modes of the fiber at an input end of the fiber. The measurement unit measures a sum of intensity profiles of individual light components output from respective ones of the plurality of spatial modes by averaging a component of interference between the plurality of spatial modes in a beam profile of combined light output from the plurality of spatial modes at an output end of the fiber. The analysis unit calculates an MFD and/or Aeff of the fiber based on the sum of the intensity profiles of the individual light components obtained by the measurement unit.
Abstract: An optical transceiver according to an aspect of the present embodiment is an optical transceiver configured to be inserted to and extracted from a cage of an apparatus along a first direction. The optical transceiver includes a device generating heat, and a housing having a rectangular parallelepiped shape with long sides extending along the first direction. The housing includes an internal space housing the device, and an outside part configured to be exposed to an outside of the cage. When the housing is engaged with the cage, the outside part having an air intake part configured to bring an outside air into the internal space for cooling the device.
Abstract: A silicon carbide single crystal substrate includes a first main surface and an orientation flat. The orientation flat extends in a <11-20> direction. The first main surface includes an end region extending by at most 5 mm from an outer periphery of the first main surface. In a direction perpendicular to the first main surface, an amount of warpage of the end region continuous to the orientation flat is not greater than 3 ?m.
Abstract: A molding method of a connector portion including an electric wire with a core wire, a terminal metal fitting and a mold portion, the molding method of insert-molding the mold portion with a plurality of molding dies forming a cavity corresponding to the mold portion, includes an injection step of closing the molding dies so that the insulating coating is compressed and deformed and injecting and filling a mold resin as a synthetic resin material of the mold portion into the cavity; and a mold opening step of separating the molding die in a mold opening direction while the mold resin has fluidity so that leakage of the mold resin is prevented by an elastic return pressure of the insulating coating.
March 6, 2020
September 10, 2020
TOYOTA JIDOSHA KABUSHIKI KAISHA, SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., AUTONETWORKS TECHNOLOGIES, LTD.
Shoichi MINAMI, Koichi YOKOTANI, Nobunori KOGA
Abstract: A optical connection structure that includes a plurality of optical connectors and a housing is disclosed. In the optical connection structure, each optical connector includes a first and a second end surfaces. Each connector hole of the housing includes first and second inner wall surfaces facing each other. The first end surface includes a first guide rail. The second end surface includes a second guide rail or a latch. The first inner wall surface includes first guide rail fitting sections provided corresponding to the respective optical connectors, the first guide rail fitting sections being slidably fitted to the first guide rails. The second inner wall surface includes second guide rail fitting sections provided corresponding to the respective optical connectors and being slidably fitted to the second guide rails, or latch engagement sections provided corresponding to the respective optical connectors, the latches being engaged with the latch engagement sections.
May 23, 2017
September 10, 2020
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Takuro WATANABE, Dai SASAKI, Yoshikyo TAMEKUNI
Abstract: The electronic circuit device includes: a first wiring pattern which is formed on a first main surface of a circuit board, has circuit elements including a switching element and mounted along a predetermined direction, and includes a virtual shortest current path connecting the circuit elements to each other along the predetermined direction; a second wiring pattern which is formed on a second main surface, and includes an opposing current path that opposes an area where the virtual shortest current path is formed; vias electrically connecting the first and second wiring patterns; and vias for heat transfer, connecting a mount area for the switching elements on the first main surface with an area on a side of the opposing current path on the second main surface. The heat dissipation member is in contact with the second main surface.
Abstract: Provided is a synthetic single crystal diamond containing nitrogen atoms at a concentration of more than 600 ppm and 1500 ppm or less. The Raman shift ?? (cm?1) of a peak in a primary Raman scattering spectrum of the synthetic single crystal diamond and the Raman shift ? (cm?1) of a peak in a primary Raman scattering spectrum of a synthetic type IIa single crystal diamond containing nitrogen atoms at a content of 1 ppm or less satisfy the following expression (1): ??????0.10??(1).
Abstract: An optical connection structure includes a first spatial multiplex transmission line, a second spatial multiplex transmission line, a first lens arrangement, a second lens arrangement and a first beam diameter conversion portion. The first spatial multiplex transmission line has a plurality of first transmission lines. The second spatial multiplex transmission line has a plurality of second transmission lines. The first lens arrangement is optically coupled with the first spatial multiplex transmission line. The second lens arrangement is optically coupled with the second spatial multiplex transmission line. The first beam diameter conversion portion has a first end face and a second end face and arranged between the first spatial multiplex transmission line and the first lens arrangement. The first beam diameter conversion portion is configured such that an optical diameter at the second end face is larger than an optical diameter at the first end face.
Abstract: An optical module includes: a light emitting unit configured to generate light; a mirror mechanism configured to reflect the light generated by the light emitting unit; and a scanning unit configured to scan the light reflected from the mirror mechanism. The light emitting unit includes: a light forming unit including a plurality of semiconductor light emitting elements and a filter that multiplexes light beams from the plurality of semiconductor light emitting elements; and a protective member disposed so as to surround the light forming unit. The mirror mechanism is disposed outside the protective member and integrated with the protective member, and the scanning unit is disposed in a region surrounded by the protective member.
Abstract: A method for manufacturing a carbon nanostructure according to an embodiment of the present invention is a method for manufacturing a carbon nanostructure, the method including a preparation step of preparing a substrate containing a carburizable metal as a main component, and a carbon nanostructure growth step of supplying a carbon-containing gas while heating the substrate, in which the carbon nanostructure growth step includes gradually cleaving a heated portion of the substrate. The cleaving in the carbon nanostructure growth step is preferably performed by subjecting the substrate to shearing. The heating in the carbon nanostructure growth step is preferably performed by irradiating a cleaving portion of the substrate with a laser. The preparation step preferably includes forming, in the substrate, a notch for inducing cleavage. Preferably, the substrate in the carbon nanostructure growth step is not oxidized.