Patents Assigned to Sumitomo Electric Industries, Ltd.
  • Publication number: 20240138265
    Abstract: A thermoelectric conversion material includes, a base material composed of SiGe, a first additive element functioning as a dopant, a second additive element different from the first additive element, and oxygen. The second additive element includes at least one of Mg, Ca, and Ti. A content ratio of the second additive element relative to the base material is 0.5 at % to 5 at %. In a rectangular area of a section of the base material, the rectangular area being selected such that a grain boundary intersects opposite sides of the rectangular area, a distribution of the second additive element and the oxygen has a positive correlation. A correlation coefficient of the correlation is in a range of 0.2 or more and less than 1.0.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Kotaro HIROSE, Masahiro ADACHI
  • Publication number: 20240138055
    Abstract: A high frequency circuit includes a first insulating layer; a second insulating layer stacked on the first insulating layer directly or with one or more intermediate layers interposed therebetween; a first ground disposed on a first surface that does not face the second insulating layer among the first surface and a second surface forming two surfaces of the first insulating layer; a first line having a first end portion to which a first alternating-current signal is to be supplied and a second line having a second end portion to which a second alternating-current signal is to be supplied that are disposed between the first insulating layer and the second insulating layer; a second ground disposed on a third surface that does not face the first insulating layer among the third surface and a fourth surface forming two surfaces of the second insulating layer; and a first shield via.
    Type: Application
    Filed: December 27, 2021
    Publication date: April 25, 2024
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shun IGARASHI, Hiroshi UEDA, Suguru YAMAGISHI, Ichiro KUWAYAMA
  • Publication number: 20240134126
    Abstract: According to one embodiment, in an optical fiber bundle, in the cross section, arrangement of cores of a first multi-core fiber and arrangement of cores of a second multi-core fiber are the same as each other, arrangement of cores of a third multi-core fiber and arrangement of cores of a fourth multi-core fiber are the same as each other, and when the first multi-core fiber is rotated 180° in a circumferential direction of the first multi-core fiber, the arrangement of the cores of the first multi-core fiber is the same as the arrangement of the cores of the fourth multi-core fiber.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 25, 2024
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Osamu SHIMAKAWA, Hidehisa TAZAWA, Masato TANAKA
  • Publication number: 20240136947
    Abstract: An inverter according to the present disclosure is an inverter connected in parallel to an alternating-current circuit to which an alternating-current power source is connected, and configured to provide an independent output to the alternating-current circuit. The inverter includes a power converter configured to convert a direct-current power into an alternating-current power to supply power to the alternating-current circuit, a voltage sensor configured to detect an alternating-current voltage of the alternating-current circuit, and a controller configured to control the power converter.
    Type: Application
    Filed: November 1, 2021
    Publication date: April 25, 2024
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventor: Naoki AYAI
  • Publication number: 20240136403
    Abstract: A silicon carbide substrate includes a first main surface, a second main surface, a threading screw dislocation, and a blind scratch. The second main surface is located opposite to the first main surface. The threading screw dislocation extends to each of the first main surface and the second main surface. The blind scratch is exposed at the first main surface and extends linearly as viewed in a direction perpendicular to the first main surface. A value obtained by dividing an area density of the blind scratch by an area density of threading screw dislocation is smaller than 0.13.
    Type: Application
    Filed: November 24, 2021
    Publication date: April 25, 2024
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kyoko OKITA, Tsubasa HONKE, Shunsaku UETA
  • Publication number: 20240134004
    Abstract: A radio wave sensor installation method has the following steps. A sighting device is mounted onto a radio wave sensor. The direction of the radio wave sensor is adjusted using the sighting device. The direction of the radio wave sensor is fixed. The sighting device is removed from the radio wave sensor. The sighting device includes a first transparent member and a second transparent member different from the first transparent member. In the step of adjusting the direction of the radio wave sensor using the sighting device, the direction of the radio wave sensor is adjusted using a first sighting mark indicated on the first transparent member and a second sighting mark indicated on the second transparent member.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 25, 2024
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Hiroaki KAWANISHI, Yasuo OGIUCHI
  • Patent number: 11966104
    Abstract: An optical modulator includes a substrate having a main surface including a first area and a second area, an optical modulation portion disposed on the first area, and an optical waveguide portion disposed on the second area. The optical modulation portion includes a first mesa waveguide and an electrode connected to the first mesa waveguide. The first mesa waveguide includes a p-type semiconductor layer, a first core layer, and an n-type semiconductor layer. The optical waveguide portion includes a second mesa waveguide. The second mesa waveguide includes a first cladding layer, a second core layer, and a second cladding layer. The second core layer is optically coupled to the first core layer. The first cladding layer contains a p-type dopant and protons. The second cladding layer contains an n-type dopant.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: April 23, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Makoto Ogasawara, Naoya Kono, Mitsuru Ekawa
  • Patent number: 11967934
    Abstract: A power amplifier circuit is a Doherty type. A peak amplifier has a first transistor and a second transistor. A first source terminal is connected to a first constant potential line. A first drain terminal and a second source terminal are connected to a first node. A second drain terminal is connected to a second constant potential line having a higher potential than the first constant potential line. A first control terminal is connected to a first bias voltage application circuit, and an input signal is input to the first control terminal via a first alternating current coupling circuit. A second control terminal is connected to a second bias voltage application circuit and is connected to the first node via a second alternating current coupling circuit. The first node is connected to the first constant potential line via a third alternating current coupling circuit.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: April 23, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Takeshi Kawasaki
  • Publication number: 20240123513
    Abstract: A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of AlaCr1-a-bCebN, a is 0.400 or more and 0.800 or less, b is 0.001 or more and 0.100 or less, the second unit layer is composed of TicSi1-cN, and c is 0.200 or more and 0.990 or less.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Haruyo FUKUI, Nozomi TSUKIHARA, Anongsack PASEUTH, Toshihiro TABATA
  • Publication number: 20240125651
    Abstract: An optical sensor includes a support layer, a thermoelectric-conversion material section disposed on the support layer and including strip-shaped p-type material layers configured to convert thermal energy into electric energy and strip-shaped n-type material lavers configured to convert thermal energy into electric energy, a heat sink, a light absorbing film, and an insulating film disposed between the thermoelectric-conversion material section and the light absorbing film. Each of the p-type material layers includes a first region overlapping the heat sink and a second region overlapping the light absorbing film. Each of the n-type material layers includes a third region overlapping the heat sink and a fourth region overlapping the light absorbing film. The p-type material layers and the n-type material layers are alternately disposed in series. The light absorbing film includes 60 mass % to 95 mass % of carbon and 5 mass % to 40 mass % of a resin.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 18, 2024
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kyohei KAKUYAMA, Kotaro HIROSE, Masahiro ADACHI
  • Publication number: 20240123514
    Abstract: A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternative layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of AlaCr1-a-bCebN, a is more than 0.500 and 0.800 or less, b is 0.001 or more and 0.100 or less, the second unit layer is composed of AlcV1-cN, c is 0.10 or more and 0.75 or less, and a and c satisfy a relationship of a>c.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Haruyo FUKUI, Nozomi TSUKIHARA, Anongsack PASEUTH, Toshihiro TABATA
  • Publication number: 20240130238
    Abstract: An optical sensor includes a support film having a first main surface and a second main surface located opposite to the first main surface in a thickness direction; a thermoelectric-conversion material section disposed on the first main surface and including a plurality of strip-shaped first material layers formed of SiGe having p-type conductivity and configured to convert thermal energy into electric energy, and a plurality of strip-shaped second material layers formed of SiGe having n-type conductivity and configured to convert thermal energy into electric energy; a heat sink disposed on the second main surface; and a light absorbing film disposed so as to form a temperature difference in each of the first material layers in longitudinal directions and each of the second material layers in longitudinal directions and configured to convert received light into thermal energy.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 18, 2024
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Kyohei KAKUYAMA, Kotaro HIROSE, Masahiro ADACHI
  • Patent number: 11960792
    Abstract: A communication assistance program is a communication assistance program assisting communication of a user, the communication assistance program causing a computer to perform a step of integrally displaying identification information that can be used for identifying a communication target and a state animation representing a state of the communication target.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: April 16, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Guiming Dai, Toshiaki Kakii, Toshifumi Hosoya, Yasushi Nomura, Yuna Okina, Tingting Fang
  • Patent number: 11962433
    Abstract: A switch device includes a plurality of communication ports; a switch unit configured to relay a frame, which has been transmitted from a function unit and to which information including an ID of a VLAN is added, to another function unit via a communication port; and a duplication unit configured to, when the diagnosis device is connected to another switch device, duplicate the frame to be relayed via a designated communication port among the plurality of communication ports, and generate a duplicate frame for diagnosis that is a frame obtained by adding, to a duplicate frame obtained through the duplication, specific information indicating that the duplicate frame for diagnosis should be transmitted to the diagnosis device. The switch unit outputs the duplicate frame for diagnosis generated by the duplication unit from a communication port corresponding to the other switch device.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: April 16, 2024
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., AUTONETWORKS TECHNOLOGIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akihito Iwata, Tatsuya Izumi, Hirofumi Urayama, Tadashi Matsumoto, Darmawan Go, Hideki Maeda, Takeshi Hagihara, Masashi Amesara, Hisashi Furukawa, Shu Ishizuka, Hideki Goto
  • Patent number: 11960115
    Abstract: An optical fiber comprises a glass fiber comprising a core and a cladding, and a coating resin layer covering the outer periphery of the glass fiber, wherein the average linear expansion coefficient of the coating resin layer at ?50° C. or more and 0° C. or less is 3.3×10?5/° C. or more and less than 9.0×10?5/° C.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: April 16, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Katsushi Hamakubo, Kazuyuki Sohma, Tatsuya Konishi
  • Patent number: 11959156
    Abstract: A cubic boron nitride sintered material comprises cubic boron nitride particles and a bonding material, wherein the bonding material comprises at least one first metallic element selected from the group consisting of titanium, zirconium, vanadium, niobium, hafnium, tantalum, chromium, rhenium, molybdenum, and tungsten; cobalt; and aluminum; the cubic boron nitride sintered material has a first interface region sandwiched between an interface between the cubic boron nitride particles and the bonding material, and a first virtual line passing through a point 10 nm apart from the interface to the bonding material side; and when an element that is present at the highest concentration among the first metallic elements in the first interface region is defined as a first element, an atomic concentration of the first element in the first interface region is higher than an atomic concentration of the first element in the bonding material excluding the first interface region.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: April 16, 2024
    Assignees: Sumitomo Electric Industries, Ltd., SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Yuichiro Watanabe, Katsumi Okamura, Akito Ishii, Yoshiki Asakawa, Akihiko Ueda, Satoru Kukino, Hisaya Hama
  • Publication number: 20240118327
    Abstract: A diamond sensor unit includes: a diamond having a color center with electron spin; an excitation light irradiation part that irradiates the diamond with excitation light; a first patch antenna that receives electromagnetic waves; an electromagnetic wave irradiation part that irradiates the diamond with the electromagnetic waves received by the first patch antenna; a detection part that detects radiated light radiated from the color center of the diamond after the diamond is irradiated with the excitation light and the electromagnetic waves; and an optical waveguide that transmits the excitation light and the radiated light.
    Type: Application
    Filed: January 26, 2022
    Publication date: April 11, 2024
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshiki NISHIBAYASHI, Hiromi NAKANISHI, Hiroshige DEGUCHI, Tsukasa HAYASHI, Natsuo TATSUMI
  • Publication number: 20240116807
    Abstract: A resin composition for primary coating of an optical fiber contains a photopolymerizable compound containing a difunctional urethane (meth)acrylate and a monofunctional urethane (meth)acrylate, and a photopolymerization initiator, the difunctional urethane (meth)acrylate is a reaction product of a diol, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, and the monofunctional urethane (meth)acrylate is a reaction product of a polyoxyalkylene monoalkyl ether, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, or a reaction product of a polyoxyalkylene monoalkyl ether and an isocyanate group-containing (meth)acrylate.
    Type: Application
    Filed: December 6, 2021
    Publication date: April 11, 2024
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yuya HOMMA
  • Publication number: 20240121898
    Abstract: A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.
    Type: Application
    Filed: May 27, 2022
    Publication date: April 11, 2024
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Yosuke FUKAYA, Koji NITTA, Daisuke SATO
  • Patent number: RE49929
    Abstract: A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 ?m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: April 16, 2024
    Assignees: Sumitomo Electric Industries, Ltd., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Shingo Kaimori, Masaaki Yamauchi, Kentaro Okamoto, Satoshi Kiya, Kazuo Murata