Circuit module housing

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Description

FIG. 1 is a top-front-left perspective view of a circuit module housing in accordance with our new design;

FIG. 2 is a left-side elevation view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a right-side elevation view thereof;

FIG. 5 is a back elevation view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D186981 May 1960 Hughes
D219274 November 1970 Huebner et al.
D261644 November 3, 1981 McKinsey et al.
D272340 January 24, 1984 Korzik
D277851 March 5, 1985 Gresham et al.
D294579 March 8, 1988 Kirpluk et al.
4386388 May 31, 1983 Beun
4470100 September 4, 1984 Rebaudo et al.
4499523 February 12, 1985 Gillett et al.
4700846 October 20, 1987 Schroder
Patent History
Patent number: D306576
Type: Grant
Filed: Oct 30, 1986
Date of Patent: Mar 13, 1990
Assignees: American Telephone and Telegraph Company (New York, NY), AT&T Information Systems Inc. (Morristown, NJ)
Inventors: Jeffrey M. Hiatt (Monmouth Beach, NJ), Chris G. Johnson (New York, NY), William H. Martin, Jr. (Holmdel, NJ), Mark E. Millman (Keyport, NJ), Timothy P. Wink (Eatontown, NJ)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Joel Sincavage
Attorney: John A. Caccuro
Application Number: 6/925,121
Classifications
Current U.S. Class: D13/40