Connector housing with detachable semiconductor components
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FIG. 1 is a front, top and right side perspective view of a connector housing with detachable semiconductor components showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof, the opposite side being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a front elevational view thereof with the three detachable semiconductor components removed for the purpose of a complete disclosure; and
FIG. 7 is a perspective view thereof with the uppermost semiconductor component withdrawn from the connector housing for the purposes of a complete disclosure. Conductors shown in broken lines leading to the connector housing are environmental elements for illustrative purposes only and form no part of the claimed design.
Type: Grant
Filed: Jan 4, 1988
Date of Patent: Nov 20, 1990
Assignee: Yazaki Corporation (Tokyo)
Inventors: Sizuo Tsubokura (Shizuoka), Itsuo Takayanagi (Shizuoka)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Joel Sincavage
Law Firm: Sughrue, Mion, Zinn, Macpeak & Seas
Application Number: 7/140,837