Individual wafer package

- Empak, Inc.
Skip to: Description  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of an individual wafer package showing our new design;

FIG. 2 is a left side elevational view thereof; the right side elevational view being a mirror image thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D276215 November 6, 1984 Wang
3615006 October 1971 Freed
3666140 May 1972 Brefka
4511038 April 16, 1985 Miller et al.
4664254 May 12, 1987 Sitwell et al.
4724960 February 16, 1988 Goodrum et al.
5045173 September 3, 1991 Guadagno et al.
Patent History
Patent number: D338402
Type: Grant
Filed: Jan 21, 1992
Date of Patent: Aug 17, 1993
Assignee: Empak, Inc. (Chanhassen, MN)
Inventors: Barry Gregerson (Chanhassen, MN), Jim Wagner (Burnsville, MN)
Primary Examiner: Bernard Ansher
Assistant Examiner: Prabhakar Deshmukh
Law Firm: Haugen and Nikolai
Application Number: 7/822,822
Classifications
Current U.S. Class: D/9418; D/9432